Title:
COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/100653
Kind Code:
A1
Abstract:
This composition contains a thermoplastic resin A, a polymer B and a surfactant C. The polymer B has a constituent unit represented by formula (1) or formula (2). The content of the resin A is 1-99 parts by mass, the content of the polymer B is 1-99 parts by mass and the content of the surfactant C is 0.01-25 parts by mass, each relative to a total of 100 parts by mass of the resin A and the polymer B. In the formulae, R1 to R3 are each independently selected from among a hydrogen atom, a halogen atom, an alkoxy group and an alkyl group. At least one hydrogen atom in each alkyl group or in each alkoxy group may independently be substituted with a halogen atom.
Inventors:
CHIBA SHUNSUKE (JP)
Application Number:
PCT/JP2022/042522
Publication Date:
June 08, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08K5/00; C08L101/00; C08L27/16
Domestic Patent References:
| WO2021221038A1 | 2021-11-04 | |||
| WO2018174220A1 | 2018-09-27 |
Foreign References:
| JP2005097574A | 2005-04-14 | |||
| JPH0485369A | 1992-03-18 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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