Title:
COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/100654
Kind Code:
A1
Abstract:
A composition according to the present invention contains a thermoplastic resin A, a polymer B and a powder C. The polymer B has a constituent unit that is represented by formula (1) or formula (2); the moisture content in the powder C that has been processed under specific processing conditions (a) is 1,000 ppm by mass to 5,000,000 ppm by mass as determined under specific measurement conditions (b); and relative to a total of 100 parts by mass of the resin A and the polymer B, the content of the resin A is 1 part by mass to 99 parts by mass, the content of the polymer B is 1 part by mass to 99 parts by mass, and the content of the powder C is 0.01 part by mass to 25 parts by mass. In the formulae, each of R1 to R3 is independently selected from among a hydrogen atom, a halogen atom, an alkoxy group and an alkyl group; and at least one hydrogen atom in each alkyl group and each alkoxy group may be independently substituted by a halogen atom.
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Inventors:
CHIBA SHUNSUKE (JP)
Application Number:
PCT/JP2022/042523
Publication Date:
June 08, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C08K3/36; C08L27/16; C08L83/04
Domestic Patent References:
| WO2021039181A1 | 2021-03-04 | |||
| WO2021221038A1 | 2021-11-04 |
Foreign References:
| JP2003253032A | 2003-09-10 | |||
| JP2014002410A | 2014-01-09 | |||
| JP2002180035A | 2002-06-26 | |||
| JP2005132919A | 2005-05-26 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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