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Patent Searching and Data


Title:
COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/100655
Kind Code:
A1
Abstract:
The composition includes a thermoplastic resin A, a polymer B, and a powder C including a metal element Q. The polymer B has a structural unit represented by formula (1) or formula (2). The value of the standard electrode potential E at 25°C of a simple substance of the metal element Q in an aqueous solution system is -1.5 to 2.0 V inclusive. The median diameter D50 of the powder C measured by a laser diffraction method is 0.5-30 μm. Relative to a total of 100 mass parts of the resin A and polymer B, the content of the resin A is 1-99 mass parts, the content of the polymer B is 1-99 mass parts, and the content of the powder C is 0.01-25 mass parts. In the formula, R1-R3 each independently are a hydrogen atom, a halogen atom, an oxygen atom, an alkoxy group, or an alkyl group. At least one hydrogen atom in each alkyl group and each alkoxy group may be substituted independently by a halogen atom.

Inventors:
CHIBA SHUNSUKE (JP)
Application Number:
PCT/JP2022/042524
Publication Date:
June 08, 2023
Filing Date:
November 16, 2022
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; A01N59/00; A01N59/16; A01N59/20; C08J5/18; C08K3/08; C08K3/10; C08L27/12
Foreign References:
JP2006213885A2006-08-17
JPH11343350A1999-12-14
CN112250974A2021-01-22
CN112280223A2021-01-29
JPH0384066A1991-04-09
JP2005132866A2005-05-26
JP2004269635A2004-09-30
JP2008239882A2008-10-09
JPH07157666A1995-06-20
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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