Title:
COMPOSITION FOR FORMING ORGANIC SEMICONDUCTOR FILM AND ORGANIC SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2016/143775
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a composition for forming an organic semiconductor film, which exhibits excellent film forming properties and enables an organic semiconductor element obtained therefrom to have high mobility; an organic semiconductor element; and a method for producing an organic semiconductor element. A composition for forming an organic semiconductor film according to the present invention is characterized by containing, as component A, an organic semiconductor represented by formula A-1 and, as component B, a solvent having a boiling point of from 150°C to 300°C (inclusive) and an SP value of from 15.0 to 18.0 (inclusive). It is preferable that the composition for forming an organic semiconductor film additionally contains a specific silicone compound.
Inventors:
SHIGENOI YUTA (JP)
KITAMURA TETSU (JP)
KITAMURA TETSU (JP)
Application Number:
PCT/JP2016/057099
Publication Date:
September 15, 2016
Filing Date:
March 08, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L51/40; H01L21/336; H01L29/786; H01L51/05; H01L51/30; H01L51/50
Domestic Patent References:
| WO2012121393A1 | 2012-09-13 | |||
| WO2016035640A1 | 2016-03-10 | |||
| WO2016039217A1 | 2016-03-17 |
Foreign References:
| JP2010177642A | 2010-08-12 |
Attorney, Agent or Firm:
NOGUCHI YASUHIRO (JP)
Takahiro Noguchi (JP)
Takahiro Noguchi (JP)
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