Title:
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING SAME, AND METHOD FOR PRODUCING PATTERNED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/146378
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a composition for forming a resist underlayer film, which is capable of forming a resist underlayer film that has excellent etching resistance, heat resistance, flatness and film defect suppressing properties; a resist underlayer film; a method for forming a resist underlayer film; and a method for producing a patterned substrate. The present invention is a composition for forming a resist underlayer film, which contains a compound that has a group represented by one of formulae (1-1) to (1-3) and a solvent. In formulae (1-1) to (1-3), each of * and ** represents a site which is bonded to a moiety other than the group represented by one of formulae (1-1) to (1-3) in the compound; each of a and b independently represents an integer of 0-3; in cases where a is 0, b is 1 or more; and in cases where a is 1 or more, b is 0.
Inventors:
NAKAFUJI SHIN-YA (JP)
EHARA KENGO (JP)
TANIGUCHI TOMOAKI (JP)
TAKANASHI KAZUNORI (JP)
EHARA KENGO (JP)
TANIGUCHI TOMOAKI (JP)
TAKANASHI KAZUNORI (JP)
Application Number:
PCT/JP2018/048360
Publication Date:
August 01, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/11; C07C233/65; C07D209/48; C07D251/52; C07D251/54; C07D405/14; C07D471/06; G03F7/20
Domestic Patent References:
| WO2018123836A1 | 2018-07-05 |
Foreign References:
| JP2008547045A | 2008-12-25 | |||
| JP2014074730A | 2014-04-24 | |||
| JPH07333855A | 1995-12-22 | |||
| JP2013228657A | 2013-11-07 | |||
| JP2003107697A | 2003-04-09 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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