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Title:
COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM REMOVABLE BY WET PROCESS
Document Type and Number:
WIPO Patent Application WO/2016/080217
Kind Code:
A1
Abstract:
[Problem] To provide a resist underlayer film formation composition for forming a resist underlayer film which can be used as a hard mask and is removable by a wet etching method using a liquid chemical such as sulfuric acid/hydrogen peroxide. [Solution] A resist underlayer film formation composition for lithography characterized by comprising ingredient (A) and ingredient (B), wherein the ingredient (A) comprises one or more hydrolyzable silanes, a hydrolyzate thereof, or a product of hydrolysis/condensation thereof, the hydrolyzable silanes comprising a hydrolyzable silane represented by formula (1): [Chemical formula 1] formula (1) [in formula (1), R1 represents an organic group represented by formula (2) [Chemical formula 2] formula (2) and has been bonded to the silicon atom by an Si-C bond, R3 represents an alkoxy group, acyloxy group, or halogen radical, symbol a is an integer of 1, b is an integer of 0-2, and a+b is an integer of 1-3], and the ingredient (B) is a crosslinking compound including a ring structure having an alkoxymethyl or hydroxymethyl group or a crosslinking compound having an epoxy or blocked-isocyanate group.

Inventors:
WAKAYAMA HIROYUKI (JP)
NAKAJIMA MAKOTO (JP)
SHIBAYAMA WATARU (JP)
ENDO MASAHISA (JP)
Application Number:
PCT/JP2015/081345
Publication Date:
May 26, 2016
Filing Date:
November 06, 2015
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
G03F7/11; H01L21/027
Domestic Patent References:
WO2011033965A12011-03-24
WO2013051558A12013-04-11
WO2012102261A12012-08-02
Foreign References:
JP2004341479A2004-12-02
JP2005523474A2005-08-04
JP2005221534A2005-08-18
JP2010085912A2010-04-15
JP2009103831A2009-05-14
JP2004157469A2004-06-03
JP2012078797A2012-04-19
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
Patent business corporation なぶさ patent trademark office (JP)
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