Title:
COMPOSITION FOR INORGANIC POWDER INJECTION MOLDING, AND MOLDED BODY AND SINTERED BODY EACH USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/002839
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composition which contains a modified polyacetal and is suitable for inorganic powder injection molding. A composition for inorganic powder injection molding according to the present invention contains a sinterable inorganic powder and an organic binder which contains a modified polyacetal (C) that has a polyacetal segment (A) and a modification segment (B). With respect to this composition for inorganic powder injection molding, the number average molecular weight of the modification segment (B) is 500 to 10,000.
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Inventors:
MIYAZAKI KUON (JP)
FUKAI MOTOHIRO (JP)
FUKAI MOTOHIRO (JP)
Application Number:
PCT/JP2022/026526
Publication Date:
January 26, 2023
Filing Date:
July 01, 2022
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
B22F3/10; B22F3/02; B28B1/24; C04B35/634; C08G2/38; C08K3/011; C08K3/013; C08L59/00
Domestic Patent References:
| WO2019219522A1 | 2019-11-21 | |||
| WO2001009213A1 | 2001-02-08 |
Foreign References:
| JPH09111306A | 1997-04-28 | |||
| JP4560261B2 | 2010-10-13 | |||
| JP2002029856A | 2002-01-29 | |||
| JP2001106581A | 2001-04-17 | |||
| JP2004076153A | 2004-03-11 | |||
| JP2001106581A | 2001-04-17 | |||
| JP2009542880A | 2009-12-03 | |||
| JP2001514017A | 2001-09-11 | |||
| JPH07293290A | 1995-11-07 | |||
| JP2003172273A | 2003-06-20 | |||
| JPH09111306A | 1997-04-28 | |||
| JP2004076153A | 2004-03-11 | |||
| JP4560261B2 | 2010-10-13 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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