Title:
COMPOSITION, METHOD FOR PRODUCING THREE-DIMENSIONALLY MOLDED CIRCUIT COMPONENT, THREE-DIMENSIONALLY MOLDED CIRCUIT COMPONENT AND ANTENNA
Document Type and Number:
WIPO Patent Application WO/2021/241473
Kind Code:
A1
Abstract:
[Problem] To provide: a composition which is capable of forming a base material that exhibits high adhesion to a circuit; a three-dimensionally molded circuit component which has high adhesion between a base material and a circuit; a method for producing this three-dimensionally molded circuit component; and an antenna which is provided with this three-dimensionally molded circuit component. [Solution] A composition according to the present invention is used for the purpose of forming a base material of a three-dimensionally molded circuit component; this composition contains a thermofusible tetrafluoroethylene polymer and an inorganic filler that has an average particle diameter of more than 0.1 μm; and the content of the tetrafluoroethylene polymer is more than 50% by mass.
Inventors:
YAMABE ATSUMI (JP)
SATO TAKASHI (JP)
KASAI WATARU (JP)
SATO TAKASHI (JP)
KASAI WATARU (JP)
Application Number:
PCT/JP2021/019518
Publication Date:
December 02, 2021
Filing Date:
May 24, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08K3/013; C08L27/18; H05K1/03; H05K3/00; H05K3/18
Domestic Patent References:
| WO2016017801A1 | 2016-02-04 |
Foreign References:
| JP2019183005A | 2019-10-24 | |||
| JP2019054034A | 2019-04-04 |
Attorney, Agent or Firm:
KOMAI Shinji et al. (JP)
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