Title:
POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/241472
Kind Code:
A1
Abstract:
Provided are: a polyamide resin having high crystallinity and high glass transition temperature, and a low mass reduction rate; and a resin composition and a molded product that use the polyamide resin. This polyamide resin comprises a diamine-derived constitutional unit and a dicarboxylic acid-derived constitutional unit, wherein: 50 mol% or more of the diamine-derived constitutional unit is a constitutional unit derived from P-benzene diethanamine; 20-95 mol% (exclusive of 95) of the dicarboxylic acid-derived constitutional unit is a constitutional unit derived from an aromatic dicarboxylic acid; and 5-80 mol% (exclusive of 5) is a constitutional unit derived from a C4-C15 α,ω-linear aliphatic dicarboxylic acid.
Inventors:
OTSUKA KOSUKE (JP)
OKAJIMA YUYA (JP)
OKAJIMA YUYA (JP)
Application Number:
PCT/JP2021/019514
Publication Date:
December 02, 2021
Filing Date:
May 24, 2021
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G69/26
Domestic Patent References:
| WO2017126409A1 | 2017-07-27 | |||
| WO2018101163A1 | 2018-06-07 | |||
| WO2010143638A1 | 2010-12-16 | |||
| WO2012098840A1 | 2012-07-26 |
Foreign References:
| JPS4419268B1 | 1969-08-21 | |||
| JPH02503541A | 1990-10-25 | |||
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| JPH083312A | 1996-01-09 | |||
| JP2013513681A | 2013-04-22 | |||
| JP2019532168A | 2019-11-07 | |||
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Other References:
See also references of EP 4159790A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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