Title:
COMPOSITION AND PHOTOSENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047856
Kind Code:
A1
Abstract:
Provided are: a photosensitive composition in which, even upon heating, there is unlikely to be an excessive decrease in the weight of components in the photosensitive composition or a composition (components other than a solvent, if the composition or the photosensitive composition contains a solvent), and which enables stable dispersion of inorganic fine particles over a long period; a cured product of the photosensitive composition; a compound which is preferably blended with the photosensitive composition; and a method for producing the compound. Provided is a composition comprising a photopolymerizable compound (A) and inorganic fine particles (B) or a photosensitive composition comprising a photopolymerizable compound (A), inorganic fine particles (B), and an initiator (C). Used as the photopolymerizable compound (A) is a compound of a specific structure having a group that contains a radical polymerizable group or a group that contains a cationically polymerizable group.
Inventors:
SUGAWARA RYUTARO (JP)
ASABA TAKURO (JP)
ASABA TAKURO (JP)
Application Number:
PCT/JP2022/031269
Publication Date:
March 30, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F20/38; C07C319/20; C07C323/64; C08F2/44
Domestic Patent References:
| WO2014119424A1 | 2014-08-07 |
Foreign References:
| JPH05303003A | 1993-11-16 | |||
| JP2010519369A | 2010-06-03 | |||
| JP2002293826A | 2002-10-09 | |||
| JPH1067736A | 1998-03-10 | |||
| JP2007119561A | 2007-05-17 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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