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Title:
COMPOSITION FOR PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE FILM, AND SURFACE-PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2020/217820
Kind Code:
A1
Abstract:
An embodiment of the present invention relates to a composition for pressure-sensitive adhesives which comprises a (meth)acrylic polymer (A), an alkali metal salt (B), and a compound (C) represented by formula (I).

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Inventors:
OKADA SHIORI (JP)
KURIMOTO SHIGERU (JP)
TOKAJI SHOHTA (JP)
KAMEI JUNICHI (JP)
Application Number:
PCT/JP2020/013054
Publication Date:
October 29, 2020
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J11/04; C09J7/38; C09J11/06; C09J133/00; C09J133/04
Foreign References:
JP2010265388A2010-11-25
JP2000129235A2000-05-09
JPH07122295A1995-05-12
JPH07282846A1995-10-27
JP2016186032A2016-10-27
JPH0757713A1995-03-03
JP2019156916A2019-09-19
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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