Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/101000
Kind Code:
A1
Abstract:
A composition for provisional fixing, which contains the components (A)-(C) described below. An adhesive for provisional fixing for the production of electronic devices, which is composed of the composition for provisional fixing. (A) a (meth)acrylate containing the components (A-1) and (A-2) described below (A-1) a monofunctional (meth)acrylate, a homopolymer of which has a Tg of from -100°C to 60°C (A-2) a polyfunctional (meth)acrylate (B) a polyisobutene homopolymer (C) a radical photopolymerization initiator
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Inventors:
UCHIDA TOMETOMO (JP)
DOMOTO TAKASHI (JP)
TANIGAWA TAKAKO (JP)
NOMURA KENJI (JP)
GOTO YOSHITSUGU (JP)
DOMOTO TAKASHI (JP)
TANIGAWA TAKAKO (JP)
NOMURA KENJI (JP)
GOTO YOSHITSUGU (JP)
Application Number:
PCT/JP2019/044773
Publication Date:
May 22, 2020
Filing Date:
November 14, 2019
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J4/02; C09J7/38; C09J11/06; C09J123/22; H01L21/304
Domestic Patent References:
| WO2018174085A1 | 2018-09-27 | |||
| WO2009096459A1 | 2009-08-06 | |||
| WO2011158654A1 | 2011-12-22 | |||
| WO2014058601A1 | 2014-04-17 |
Foreign References:
| JP2004210879A | 2004-07-29 | |||
| JP2018048274A | 2018-03-29 | |||
| JP2004064040A | 2004-02-26 | |||
| JP2006328104A | 2006-12-07 | |||
| JP5890177B2 | 2016-03-22 | |||
| JP2009524705W | ||||
| JP6139862B2 | 2017-05-31 | |||
| JP2017226785A | 2017-12-28 | |||
| JP6377956B2 | 2018-08-22 | |||
| JP2016106404A | 2016-06-16 | |||
| JP4565804B2 | 2010-10-20 | |||
| JP2019501790W | ||||
| JP4405246B2 | 2010-01-27 |
Other References:
J. BRANDRUPE. H. IMMERGUT: "Polymer Handbook", 1975, J. WILEY
See also references of EP 3882323A4
See also references of EP 3882323A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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