COMPOUND, MOLDED BODY AND ELECTRONIC COMPONENT

Title:

COMPOUND, MOLDED BODY AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2019/229961

Kind Code:

A1

Abstract:

The present invention provides a compound which suppresses cracks in a molded body that is produced from this compound and a metal member. This compound comprises a metal element-containing powder and a resin composition; and if Tg (°C) represents the glass transition temperature of a cured product of this compound, CTE1 (ppm/°C) represents the thermal expansion coefficient of the cured product of this compound at a temperature of 25°C or more but less than Tg°C, CTE2 (ppm/°C) represents the thermal expansion coefficient of the cured product of this compound at a temperature of from Tg°C to 250°C (inclusive), E (GPa) represents the bending modulus of elasticity of the cured product of this compound at 250°C, and σ (MPa) represents the bending strength of the cured product of this compound at 250°C, the stress index SI of the cured product of this compound as defined by mathematical formula (I) is from 0 to 150 (inclusive). (I): SI = |(CTE1 × (Tg - 25) + CTE2 × (250 - Tg) - 17 × (250 - 25)) × E/σ|

Inventors:

INOUE HIDETOSHI (JP)
OSAKA MASAHIKO (JP)
TAKEUCHI YUMA (JP)
SEKIYA HIROKI (JP)
YAMAGUCHI SHOHEI (JP)
TAKEUCHI KAZUMASA (JP)

Application Number:

PCT/JP2018/021056

Publication Date:

December 05, 2019

Filing Date:

May 31, 2018

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD (JP)

International Classes:

C08L101/00; C08K3/08; C08K3/10; H01L23/29; H01L23/31; C08L63/00; C08L83/04; C08L83/10

Domestic Patent References:

WO2012029278A1

2012-03-08

Foreign References:

JP2010138384A	2010-06-24
JP2014177591A	2014-09-25
JPS58219218A	1983-12-20
JPH07242732A	1995-09-19
JPH1060085A	1998-03-03
JP2017112218A	2017-06-22
JPH1167513A	1999-03-09
JP2010212442A	2010-09-24
JP2014013803A	2014-01-23

Other References: