Title:
RESIN COMPOSITION, RESIN MEMBER, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/229962
Kind Code:
A1
Abstract:
This resin composition, when cured, has a thermal conductivity of 5 W/(m·K) or more and a storage modulus of 8 GPa or less.
Inventors:
KIGUCHI KAZUYA (JP)
NISHIYAMA TOMOO (JP)
INOUE HIDETOSHI (JP)
AMANO YOSHIHIRO (JP)
FUJIMOTO DAISUKE (JP)
NISHIYAMA TOMOO (JP)
INOUE HIDETOSHI (JP)
AMANO YOSHIHIRO (JP)
FUJIMOTO DAISUKE (JP)
Application Number:
PCT/JP2018/021058
Publication Date:
December 05, 2019
Filing Date:
May 31, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/12; B32B15/092; C08G59/20; C08J5/18; C08L63/00; H01L23/36; H01L23/373
Domestic Patent References:
| WO2014115456A1 | 2014-07-31 | |||
| WO2016140020A1 | 2016-09-09 | |||
| WO2014136484A1 | 2014-09-12 |
Foreign References:
| JP2011037981A | 2011-02-24 | |||
| JP2013053180A | 2013-03-21 | |||
| JP2013071960A | 2013-04-22 | |||
| JP2011124078A | 2011-06-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
Previous Patent: COMPOUND, MOLDED BODY AND ELECTRONIC COMPONENT
Next Patent: PROBE ELECTROSPRAY IONIZATION MASS SPECTROMETRY
Next Patent: PROBE ELECTROSPRAY IONIZATION MASS SPECTROMETRY