Title:
COMPOUND AND MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2021/112135
Kind Code:
A1
Abstract:
A compound comprising a metallic-element-containing powder and a resin composition, wherein the resin composition comprises an epoxy resin and one or more compounds each having a siloxane bond, the compounds having a siloxane bond being contained in an amount of 20 parts by mass or less per 100 parts by mass of the epoxy resin and including a siloxane compound having a structure represented by chemical formula (1).
Inventors:
INABA YOSHIHITO (JP)
ENDO YOSHINORI (JP)
ENDO YOSHINORI (JP)
Application Number:
PCT/JP2020/044901
Publication Date:
June 10, 2021
Filing Date:
December 02, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L83/04; C08K3/08; C08L63/00
Domestic Patent References:
| WO2019229960A1 | 2019-12-05 |
Foreign References:
| JP2010138384A | 2010-06-24 | |||
| JPH06163225A | 1994-06-10 | |||
| JPH1167513A | 1999-03-09 | |||
| CN104371617A | 2015-02-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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