Title:
LOW-DIELECTRIC LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/112134
Kind Code:
A1
Abstract:
[Problem] To provide a layered product having good adhesiveness, dielectric characteristics, and linear expansion properties. [Solution] A layered product comprising a metal substrate, an adhesive layer, and a resin substrate, which are layered in this order, wherein the adhesive layer contains a filler (A) and a cured product of an acid-modified polyolefin (B) and an epoxy resin (C), and, in a cross-section of the adhesive layer taken in a direction perpendicular to the surface of the layered product, the number a1 of particles of the filler (A) included in a region closer to the surface of the metal substrate from the middle point is greater than the number b1 of particles of the filler (A) included in a region closer to the surface of the resin substrate from the middle point thereof.
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Inventors:
IRISAWA HAYATO (JP)
Application Number:
PCT/JP2020/044900
Publication Date:
June 10, 2021
Filing Date:
December 02, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B15/08; C09J11/04; C09J11/06; C09J123/26; C09J163/00; H05K3/38
Domestic Patent References:
| WO2017077912A1 | 2017-05-11 | |||
| WO2014148155A1 | 2014-09-25 |
Foreign References:
| JP2009084507A | 2009-04-23 | |||
| JP2019127501A | 2019-08-01 | |||
| JP2006045388A | 2006-02-16 | |||
| JPH10242607A | 1998-09-11 | |||
| JP2016192397A | 2016-11-10 |
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