Title:
COMPOUND SEMICONDUCTOR FLEXIBLE CARBON-BASED FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/082373
Kind Code:
A1
Abstract:
A compound semiconductor flexible carbon-based film and a preparation method therefor, the method comprising the following steps: S1. hybridizing an anhydride containing a phenyl group with a diamine to obtain a thermoplastic polyimide resin precursor; S2. using the thermoplastic polyimide resin precursor to prepare a polyimide thin film; S3. carbonizing the polyimide thin film with black lead, and doping the polyimide thin film with nano-metal for ion implantation and ion exchange, wherein nano-monoclinic crystals in the film are phase-changed into tetragonal crystals and are changed from single crystals into superlattices; and S4. carrying out a high-temperature annealing treatment on the material obtained in step S3 to form an ultra-flexible ultra-thin compound semiconductor film. The foregoing technical solution provides a compound semiconductor material that has a high-performance, is ultra-flexible, and has ultra-thin microstructures.
Inventors:
LIU PING (CN)
Application Number:
PCT/CN2020/087048
Publication Date:
May 06, 2021
Filing Date:
April 26, 2020
Export Citation:
Assignee:
SHENZHEN DANBOND TECH CO LTD (CN)
International Classes:
C01B32/05; C08G73/10; C08J5/18
Foreign References:
| CN110862076A | 2020-03-06 | |||
| CN109776826A | 2019-05-21 | |||
| CN105731434A | 2016-07-06 | |||
| CN106829930A | 2017-06-13 | |||
| CN106206682A | 2016-12-07 | |||
| CN104909358A | 2015-09-16 | |||
| KR20170081874A | 2017-07-13 |
Attorney, Agent or Firm:
CHINA TRUER IP (CN)
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