CONDUCTIVE ELECTRODE, PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

Title:

CONDUCTIVE ELECTRODE, PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/120932

Kind Code:

A1

Abstract:

The present application relates to the technical fields of conductive electrodes and electronic devices, and specifically relates to a conductive electrode, a preparation method therefor and an electronic device. The conductive electrode comprises: a transparent conductive film, which is disposed on a substrate; an adhesive intermediate layer, which is disposed on the transparent conductive film; and a metal layer, which is disposed on the adhesive intermediate layer. The metal layer is mainly formed from precious metals, and is used to bond with an external circuit. The present application can increase the bonding strength between a transparent conductive electrode and an external substrate, and at the same time, meet electrical connectivity and connection reliability requirements.

Inventors:

SHANG PANJU (CN)
SI HUI (CN)
YOU JINSONG (CN)
ZHENG HONG (CN)
WU BIN (CN)

Application Number:

PCT/CN2020/128329

Publication Date:

June 24, 2021

Filing Date:

November 12, 2020

Export Citation:

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Assignee:

HONOR DEVICE CO LTD (CN)

International Classes:

H01B5/14; H01B13/00

Foreign References:

CN104064257A	2014-09-24
CN104882192A	2015-09-02
CN104947140A	2015-09-30
CN102543266A	2012-07-04
CN104979037A	2015-10-14
US20170012147A1	2017-01-12
CN201911329101A	2019-12-20

Other References: