Title:
CONDUCTIVE PARTI CLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/246523
Kind Code:
A1
Abstract:
Provided are conductive particles that can increase saturation magnetization and reduce remanent magnetization, and can increase conduction reliability when electrically connecting electrodes. Each conductive particle according to the present invention comprises a resin particle and a conductive part disposed on an outer side of an outer surface of the resin particle, and also comprises a magnetic body part including a magnetic body disposed between the resin particle and the conductive part, and a ratio of the remanent magnetization to the saturation magnetization in the conductive particle is 0.4 or less (configuration A), or the conductive part comprises a magnetic body, and the ratio of the remanent magnetization to the saturation magnetization in the conductive particle is 0.4 or less (configuration B), or the resin particle comprises a magnetic body (configuration C).
Inventors:
OBINATA SHUUHEI (JP)
MATSUURA HIROTO (JP)
WAKIYA TAKESHI (JP)
MATSUURA HIROTO (JP)
WAKIYA TAKESHI (JP)
Application Number:
PCT/JP2021/021408
Publication Date:
December 09, 2021
Filing Date:
June 04, 2021
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/00; H01B1/22; H01B5/00; H01R11/01
Domestic Patent References:
| WO2020004273A1 | 2020-01-02 |
Foreign References:
| JPH03263801A | 1991-11-25 | |||
| JPH05190014A | 1993-07-30 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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