Title:
CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/171631
Kind Code:
A1
Abstract:
Conductive particles P which have an individual dispersion ratio of at least 90.0% and are used to produce an adhesive film for circuit connection, said conductive particles P each comprising a conductive parent particle 31 and child particles 32 covering the surface of the parent particle 31, wherein the ratio of the average particle size of the child particles 32 in ethyl acetate to the average particle size of the child particles 32 in water is at most 1.20.
Inventors:
MATSUZAWA MITSUHARU (JP)
YAMAZAKI SHOHEI (JP)
TOMISAKA KATSUHIKO (JP)
MATSUZAKI TOSHIAKI (JP)
SEKI HIDEYUKI (JP)
YAMAZAKI SHOHEI (JP)
TOMISAKA KATSUHIKO (JP)
MATSUZAKI TOSHIAKI (JP)
SEKI HIDEYUKI (JP)
Application Number:
PCT/JP2023/008403
Publication Date:
September 14, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01B5/00; C09J7/35; H01B1/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01; H01R43/00
Domestic Patent References:
| WO2017051842A1 | 2017-03-30 | |||
| WO2019194135A1 | 2019-10-10 |
Foreign References:
| JP2012155958A | 2012-08-16 | |||
| JP2015167106A | 2015-09-24 | |||
| JP2015167186A | 2015-09-24 | |||
| JP2021509526A | 2021-03-25 | |||
| JP2018073808A | 2018-05-10 | |||
| JP2013105535A | 2013-05-30 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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