CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, AND CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME

Title:

CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, AND CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2023/171630

Kind Code:

A1

Abstract:

The present invention provides conductive particles P which have a monodispersity ratio of 90.0% or more and are used for the production of an adhesive film for circuit connection, and which comprise conductive mother particles 31 and child particles 32 that cover the surfaces of the mother particles 31. If rX and dX are the particle radius and the particle diameter of each child particle 32 as determined by observation with an SEM at a magnification of 30,000 times, and dY is the average particle diameter of the child particles 32, which is the average value of the particle diameters dX, the shape irregularity of the child particles 32 as obtained by formula (1) is 2.0 or less.　(1): (Shape irregularity) = D/rY × 100 (In formula (1), rY represents the radius of a virtual sphere having a diameter that is equal to dY; and D represents the average of the absolute differences between the particle radii rX of the child particles 32 and the radius rY of the virtual sphere.)

More Like This:

JPH06223633	CONDUCTIVITY-ANISOTROPIC ELECTRODE CONNECTING COMPOSITION AND ITS HARDENED FILM
JP7095127	Manufacturing method of conductive particles and conductive particles
JPS57105907	PHOTOELECTRIC CABLE

Inventors:

MATSUZAWA MITSUHARU (JP)
TOMISAKA KATSUHIKO (JP)
YAMAZAKI SHOHEI (JP)
SEKI HIDEYUKI (JP)
MATSUZAKI TOSHIAKI (JP)

Application Number:

PCT/JP2023/008401

Publication Date:

September 14, 2023

Filing Date:

March 06, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

RESONAC CORP (JP)

International Classes:

H01B5/00; C09J7/35; H01B1/00; H01B1/24; H01B5/16; H01B13/00; H01R11/01; H01R43/00

Domestic Patent References:

WO2017051842A1	2017-03-30
WO2019194135A1	2019-10-10

Foreign References:

JP2013105535A	2013-05-30
JP2015167106A	2015-09-24
JP2015167186A	2015-09-24
JP2021509526A	2021-03-25
JP2018073808A	2018-05-10

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: SEMICONDUCTOR LIGHT-EMITTING ELEMENT

Next Patent: CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION S...