Title:
CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE ADHESIVE, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/152943
Kind Code:
A1
Abstract:
The present invention provides conductive particles, an anisotropic conductive adhesive, and a connection structure which are capable of achieving low connection resistance, and high connection reliability, even when used on wiring of aluminium or the like on which a surface oxide film is readily formed. The present invention provides conductive particles 10 obtained by forming metal layers 12 on the surfaces of particles 11 to have a film formed thereon. The Vickers hardness (Hv) of each of the metal layers 12 is at least 35, but not more than 400. The thickness of each of the metal layers 12 is at least 5 nm, but not more than 250 nm.
Inventors:
KUMAKURA HIROYUKI (JP)
Application Number:
PCT/JP2016/059272
Publication Date:
September 29, 2016
Filing Date:
March 23, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01B5/00; C09J9/02; H01B1/00; H01B1/22; H01R4/04; H05K3/32
Foreign References:
| JP2012028250A | 2012-02-09 | |||
| JP2013138013A | 2013-07-11 | |||
| JP2014029857A | 2014-02-13 | |||
| JP2012164454A | 2012-08-30 | |||
| JP2015005503A | 2015-01-08 | |||
| JP2002331385A | 2002-11-19 |
Attorney, Agent or Firm:
ABE, Hideki et al. (JP)
Hideki Abe (JP)
Hideki Abe (JP)
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