Title:
METHOD FOR PRODUCING CONDUCTIVE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2016/152942
Kind Code:
A1
Abstract:
The present invention provides a method for producing conductive particles which is capable of forming uniform metal layers on particles to have a film formed thereon, without causing the particles to agglomerate during formation of the metal layers. In the present invention, conductive particles 10 are produced by using a sputtering target 22 comprising a metal material to form, by way of sputtering, metal layers 12 on the surfaces of particles 11 to have a film formed thereon. When forming the metal layers 12, sputtering is intermittently performed while causing a vibration container 25 in which the particles 11 to have the film formed thereon are disposed to vibrate.
Inventors:
KUMAKURA HIROYUKI (JP)
Application Number:
PCT/JP2016/059271
Publication Date:
September 29, 2016
Filing Date:
March 23, 2016
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C23C14/34; B22F1/16; C23C14/00; C23C14/16; B23K35/26; C22C13/00
Foreign References:
| JP2005264297A | 2005-09-29 | |||
| JP2003033668A | 2003-02-04 | |||
| JP2001321983A | 2001-11-20 | |||
| JP2002331385A | 2002-11-19 | |||
| JP2002120086A | 2002-04-23 | |||
| JP2005281765A | 2005-10-13 | |||
| JP2014160708A | 2014-09-04 | |||
| JP2015197955A | 2015-11-09 |
Attorney, Agent or Firm:
ABE, Hideki et al. (JP)
Hideki Abe (JP)
Hideki Abe (JP)
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