Title:
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/145664
Kind Code:
A1
Abstract:
Provided are conductive particles that can decrease connection resistance and increase conduction reliability when the conductive particles are used for electrical connection between electrodes. A conductive particle according to the present invention comprises a base material particle and a conductive part disposed on the surface of the base material particle. The compressive elasticity modulus value of the conductive particle at 10% compression is greater than or equal to the compressive elasticity modulus value of the conductive particle at 20% compression. The compressive elasticity modulus value of the conductive particle at 20% compression is greater than or equal to the compressive elasticity modulus value of the conductive particle at 30% compression. The ratio of the absolute value of the difference between the compressive elasticity modulus value of the conductive particle at 10% compression and the compressive elasticity modulus value of the conductive particle at 20% compression to the compressive elasticity modulus value of the conductive particle at 20% compression is less than or equal to 0.20.
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Inventors:
SHIRAISHI SHOTA (JP)
ABE HIROTAKA (JP)
KURIURA RYOU (JP)
ABE HIROTAKA (JP)
KURIURA RYOU (JP)
Application Number:
PCT/JP2023/001815
Publication Date:
August 03, 2023
Filing Date:
January 23, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01R11/01
Domestic Patent References:
| WO2018181694A1 | 2018-10-04 | |||
| WO2012020799A1 | 2012-02-16 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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