CONDUCTIVE PARTICLES, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Title:

CONDUCTIVE PARTICLES, METHOD FOR MANUFACTURING CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/149294

Kind Code:

A1

Abstract:

Provided are conductive particles with which is it possible to make a crack in a conductive layer less likely to occur, and enhance the conduction reliability of an obtainable connection structure even when mounted at low pressure.　Conductive particle according to the present invention each have a base material particle, and a conductive layer having a crystal structure including grain boundaries, and having protrusions on the outer surface thereof. The conductive layer is disposed on the outer surface of the base material particle, and the grain boundaries in the conductive layer are oriented in the thickness direction of the conductive layer.

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Inventors:

KUBO ATSUKI (JP)
KURIURA RYOU (JP)
SUZUKI MINORI (JP)

Application Number:

PCT/JP2023/002209

Publication Date:

August 10, 2023

Filing Date:

January 25, 2023

Export Citation:

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

H01B5/00; H01B1/00; H01B1/22; H01B13/00

Domestic Patent References:

WO2018181546A1

2018-10-04

Foreign References:

JP2004131801A	2004-04-30
JP2020057612A	2020-04-09
JP2006206985A	2006-08-10

Attorney, Agent or Firm:

OSAKA FRONT (JP)

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