Title:
CONDUCTIVE PASTE, ELECTRONIC COMPONENT, AND LAMINATED CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/190616
Kind Code:
A1
Abstract:
Provided is a conductive paste which can further improve adhesion to a substrate. This conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, wherein the glass transition point of a dried body, which is obtained by mixing a binder resin, an additive, and an organic solvent in the same proportion as in the conductive paste and then drying the mixture, is 30°C to 55°C.
Inventors:
YOSHIDA NAOFUMI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
Application Number:
PCT/JP2023/012695
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H01G4/30; C09D5/24; C09D7/61; C09D7/63; C09D129/14; H01B1/22; H05K1/09; H05K1/16
Domestic Patent References:
| WO2021106470A1 | 2021-06-03 | |||
| WO2020137290A1 | 2020-07-02 | |||
| WO2014061556A1 | 2014-04-24 |
Foreign References:
| JP2017183247A | 2017-10-05 | |||
| JP2018037630A | 2018-03-08 | |||
| JP2018049940A | 2018-03-29 | |||
| JP2006004905A | 2006-01-05 |
Attorney, Agent or Firm:
USAMI, Aya et al. (JP)
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