Title:
CONDUCTIVE PASTE, ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/190615
Kind Code:
A1
Abstract:
Provided is a conductive paste with which adhesion to a base material can be further enhanced. This conductive paste contains a conductive powder, an additive, a binder resin, and an organic solvent, wherein the conductive paste contains, as an additive, a rosin derivative that includes a hydroxyl group or an amine group.
Inventors:
YOSHIDA NAOFUMI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
AIKAWA TATSUO (JP)
TAKANO KIYOSHI (JP)
KAWAMURA TAKUYA (JP)
NARITA SHUSEI (JP)
FUKUDA KENJI (JP)
Application Number:
PCT/JP2023/012694
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H01G4/30; C09D5/24; C09D7/61; C09D7/63; C09D129/14; H01B1/22; H05K1/09; H05K1/16
Domestic Patent References:
| WO2021106470A1 | 2021-06-03 | |||
| WO2020137290A1 | 2020-07-02 |
Foreign References:
| JP2017183247A | 2017-10-05 | |||
| JP2018049940A | 2018-03-29 | |||
| JP2017135058A | 2017-08-03 |
Attorney, Agent or Firm:
USAMI, Aya et al. (JP)
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