Title:
CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2014/098036
Kind Code:
A1
Abstract:
A conductive paste being an embodiment of the present invention contains metal microparticles (A), a resin binding agent (B), and an organic solvent (C), and also contains an organic monocarboxylic acid metal salt (D1), a diketone chelating agent (D2), and an aromatic compound (D3) that is indicated by general formula (1). This conductive paste is capable of forming an electrode having excellent conductive stability over time, and/or has excellent printing characteristics.
Inventors:
MORIUCHI FUMIO (JP)
SATO HIDEHARU (JP)
SATO HIDEHARU (JP)
Application Number:
PCT/JP2013/083638
Publication Date:
June 26, 2014
Filing Date:
December 16, 2013
Export Citation:
Assignee:
PELNOX LTD (JP)
International Classes:
C08L101/00; C08K5/07; C08K5/09; C08K5/098; H01B1/02; H01B1/22; H05K1/09
Domestic Patent References:
| WO2013147235A1 | 2013-10-03 |
Foreign References:
| JPH1072673A | 1998-03-17 | |||
| JPH05217422A | 1993-08-27 | |||
| JPH0822722A | 1996-01-23 | |||
| JP2014011006A | 2014-01-20 |
Attorney, Agent or Firm:
KOUNO, HIROAKI (JP)
Hiroaki Kono (JP)
Hiroaki Kono (JP)
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