CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE STRUCTURE USING SAME

Title:

CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE STRUCTURE USING SAME

Document Type and Number:

WIPO Patent Application WO/2019/189750

Kind Code:

A1

Abstract:

One aspect of the present invention pertains to a conductive composition containing at least an acrylic resin and a conductive powder. The acrylic resin contains at least polymerized units (A) of an epoxy group-containing (meth)acrylate and polymerized units (B) of an isobornyl group-containing (meth)acrylate. The amount of the polymerized units (B) is 5.0-50.0 parts by mass relative to 100 parts by mass of the acrylic resin.

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Inventors:

FUKAO TOMOHIRO
SAWADA TOMOAKI
ABE TAKATOSHI

Application Number:

PCT/JP2019/013977

Publication Date:

October 03, 2019

Filing Date:

March 29, 2019

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

C08L33/14; C08G59/20; C08K3/01; C08K5/00; C08L63/00; H01B1/20; H01B1/22

Foreign References:

JP2015101606A	2015-06-04
US20030162128A1	2003-08-28
JP2001135140A	2001-05-18
JP2006335861A	2006-12-14

Attorney, Agent or Firm:

KOTANI, Etsuji et al. (JP)

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