Title:
CONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/120109
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a conductive substrate and a method for manufacturing a conductive substrate, wherein the sulfuration resistance and light resistance of a conductive fine wire section is excellent. A conductive substrate according to the present invention is a conductive substrate having a base material and a conductive layer that is positioned on the base material. The conductive layer has a conductive fine wire section that includes metal, and a transparent insulating section that is positioned adjacent to the conductive fine wire section, includes a polymer compound, and does not include metal. The conductive layer includes a thiol compound, and the ratio (A2/A1) of the thiol compound content A2 in the transparent insulating section, adjacent to the conducting fine wire section and in the same width as the wire width in the conducting fine wire section, to the thiol compound content A1 in the depth region of the conductive fine wire section where the metal is present, is 1.2 or greater.
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Inventors:
OIKAWA TOKUJU (JP)
TANAKA SATOSHI (JP)
TANAKA SATOSHI (JP)
Application Number:
PCT/JP2022/044530
Publication Date:
June 29, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B5/14; B32B7/025; G06F3/041; G06F3/044; H01B13/00
Domestic Patent References:
| WO2014156827A1 | 2014-10-02 | |||
| WO2008111551A1 | 2008-09-18 |
Foreign References:
| JP2019016488A | 2019-01-31 | |||
| JP2009146678A | 2009-07-02 | |||
| JP2009185342A | 2009-08-20 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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