Title:
CONDUCTOR CONNECTING STRUCTURE, ELECTRONIC COMPONENT, PRODUCTION METHOD FOR CONDUCTOR CONNECTING STRUCTURE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/180744
Kind Code:
A1
Abstract:
The conductor connecting structure according to the present invention is characterized by comprising: a substrate which serves as a base; a columnar conductor which penetrates the substrate; a wiring pattern which is formed on at least one principal surface of the substrate, and the upper surface of which is flush with the upper surface of the columnar conductor; and a plating electrode layer which is disposed on the entire upper surface of the columnar conductor and on the upper surface of the wiring pattern and which connects the columnar conductor and the wiring pattern via metallic bonding.
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Inventors:
OKAZAKI ATSUNOBU (JP)
MIZUSHIRO MASAAKI (JP)
MIZUSHIRO MASAAKI (JP)
Application Number:
PCT/JP2018/010942
Publication Date:
October 04, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/40; H05K3/06; H05K3/24; H05K3/46
Foreign References:
| JP2006186098A | 2006-07-13 | |||
| JP2008016729A | 2008-01-24 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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