Title:
CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS
Document Type and Number:
WIPO Patent Application WO/2024/042878
Kind Code:
A1
Abstract:
A connected body of metal materials having an overlapping portion where an end A of a metal material A and an end B of a metal material B are overlapped via a film composed mainly of a thermoplastic resin, wherein the film is one that has been melted and solidified at the overlapping portion.
Inventors:
TAKAHASHI NOBUYUKI (JP)
SAITO HAYATO (JP)
SAITO HAYATO (JP)
Application Number:
PCT/JP2023/024875
Publication Date:
February 29, 2024
Filing Date:
July 05, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B29C65/42; B29C65/64; B32B15/08; B65H37/04; C09J7/30; C09J163/00; C09J171/10
Foreign References:
| JPH10157896A | 1998-06-16 | |||
| DE102016212622A1 | 2018-01-18 | |||
| JP2017177465A | 2017-10-05 | |||
| JP2021066805A | 2021-04-30 | |||
| JP2009298136A | 2009-12-24 | |||
| JPS4821724A |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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