Title:
CONNECTION STRUCTURE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/125779
Kind Code:
A1
Abstract:
Provided is a connection structure manufacturing method by which it is possible to efficiently dispose solder particles on electrodes and by which it is possible to increase conduction reliability between the electrodes. This connection structure manufacturing method comprises: a step for disposing a conductive paste on a surface of a first member to be connected, said conductive paste containing a plurality of solder particles and a thermosetting component; a step for disposing a second member to be connected on the reverse surface of the conductive paste from the first member to be connected side in a manner such that a first electrode and a second electrode oppose one another; and a step for forming a connection part from the conductive paste by heating the conductive paste, said connection part connecting the first member to be connected and the second member to be connected. In the step for disposing the second member to be connected and the step for forming the connection part, the weight of the second member to be connected is applied to the conductive paste without the application of pressure.
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Inventors:
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2015/054299
Publication Date:
August 27, 2015
Filing Date:
February 17, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B13/00; C08K3/08; C08L101/00; H01B1/22; H01B5/16; H01R11/01
Domestic Patent References:
| WO2011115105A1 | 2011-09-22 |
Foreign References:
| JP2007280999A | 2007-10-25 | |||
| JP2012216770A | 2012-11-08 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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