Title:
EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/125780
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an epoxy resin having exceptional heat resistance and heat resistance degradation characteristics suitable for electrical and electronic materials applications, especially semiconductor sealing, an epoxy resin composition using the same; and a cured product thereof. This epoxy resin is a naphthol-cresol novolak epoxy resin represented by formula (1), wherein the content of epoxy compound having a structure represented by formula (2) is 9 area% or less by GPC (gel permeation chromatography, detector: RI) area percentage, and the content of epoxy compound having a structure represented by formula (3) is 9 area% or less by GPC area percentage. (In formula (1), n is the number of repetitions, the average of which is 2-10, and it is never the case that all A are the same.)
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Inventors:
NAKANISHI MASATAKA (JP)
EBARA SEIJI (JP)
EBARA SEIJI (JP)
Application Number:
PCT/JP2015/054302
Publication Date:
August 27, 2015
Filing Date:
February 17, 2015
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/08
Domestic Patent References:
| WO2014050419A1 | 2014-04-03 |
Foreign References:
| JP2000053739A | 2000-02-22 | |||
| JPH11171954A | 1999-06-29 | |||
| JPH09291127A | 1997-11-11 | |||
| JPH1180316A | 1999-03-26 | |||
| JP2014189640A | 2014-10-06 | |||
| JP2014189750A | 2014-10-06 | |||
| JP2014065789A | 2014-04-17 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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