CONNECTION STRUCTURE AND MANUFUCTURING METHOD THEREFOR

Title:

CONNECTION STRUCTURE AND MANUFUCTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2021/131620

Kind Code:

A1

Abstract:

This connection structure comprises a first circuit member that has a plurality of first electrodes, a second circuit member that has a plurality of second electrodes, and an intermediate layer that has a plurality of joint portions for connecting the first electrodes and the second electrodes electrically, wherein the first electrodes and/or the second electrodes that are connected at the joint portions are gold electrodes, and at least 90% of the plurality of joint portions include a first region containing a tin-gold alloy that joins the first electrodes and the second electrodes, and a second region containing bismuth that contacts the first region.

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Inventors:

AKAI KUNIHIKO (JP)
MIYAJI MASAYUKI (JP)
HATA JUNICHI (JP)
EJIRI YOSHINORI (JP)
MORIYA TOSHIMITSU (JP)

Application Number:

PCT/JP2020/045304

Publication Date:

July 01, 2021

Filing Date:

December 04, 2020

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

H01B13/00; H01L21/60; H01R11/01; H05K3/32; H05K3/34

Domestic Patent References:

WO2014061085A1

2014-04-24

Foreign References:

JP2017045832A	2017-03-02
JP2014225654A	2014-12-04
JP2012142450A	2012-07-26
JP2019029135A	2019-02-21
JPH0523887A	1993-02-02
JP2003007894A	2003-01-10
JP2015106654A	2015-06-08
JP2014084395A	2014-05-12
JP2016076494A	2016-05-12

Other References: