Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONTAINER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/048106
Kind Code:
A1
Abstract:
This container manufacturing method involves an RFID inlay placement step for placing an RFID inlay, on which a thermoplastic adhesive is provided, on the inner surface of a mold with the thermoplastic adhesive exposed, and a forming step for supplying a heated material into a mold and forming a container provided with the RFID inlay on the outer surface with a thermoplastic adhesive interposed therebetween.

Inventors:
NITTA SHINYA (JP)
Application Number:
PCT/JP2022/034858
Publication Date:
March 30, 2023
Filing Date:
September 16, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SATO HOLDINGS KK (JP)
International Classes:
B29C49/20; B29C45/00; B29C45/14; B65D25/20
Foreign References:
JP2010509098A2010-03-25
JP2010105719A2010-05-13
JP2007128384A2007-05-24
JP2009073518A2009-04-09
JP2021155705A2021-10-07
Attorney, Agent or Firm:
GOTOH & PARTNERS (JP)
Download PDF:



 
Previous Patent: TRANSFORMER CHIP

Next Patent: HARD COAT FILM