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Title:
TRANSFORMER CHIP
Document Type and Number:
WIPO Patent Application WO/2023/048105
Kind Code:
A1
Abstract:
This transformer chip comprises a first coil and a second coil provided on a substrate major surface of a substrate. The first coil and the second coil are arranged along a first direction on the substrate major surface of the substrate. The first coil comprises a plurality of first substrate wires and a plurality of first connection wires arrayed in an X-direction. The plurality of first substrate wires extend along a direction transverse to the X-direction. The plurality of first connection wires are each connected between two first substrate wires adjacent to each other in the X-direction. The second coil comprises a plurality of second substrate wires and a plurality of second connection wires arrayed in the X-direction. The plurality of second substrate wires extend along the direction transverse to the X-direction. The plurality of second connection wires are each connected between two second substrate wires adjacent to each other in the X-direction.

Inventors:
HIGUCHI TORU (JP)
KUWAHARA EIJI (JP)
Application Number:
PCT/JP2022/034857
Publication Date:
March 30, 2023
Filing Date:
September 16, 2022
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01F17/00; H01F19/00; H01F27/00; H01L21/822; H01L27/04
Foreign References:
JP2000101213A2000-04-07
JP2004235584A2004-08-19
JP2000353617A2000-12-19
JPS5284452A1977-07-14
JPH10189339A1998-07-21
JP2005347286A2005-12-15
JPH04354308A1992-12-08
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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