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Title:
CONVERTER MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2010/119600
Kind Code:
A1
Abstract:
Provided is a converter module having the size and the height thereof easily reduced without deteriorating pressure detection sensitivity. A converter module (100) is provided with a converter (110) which converts vibration of a diaphragm (111) into electrical signals, and a semiconductor substrate (120) which processes the electrical signals converted by means of the converter (110). The converter (110) has: a base (112) having a hollow portion (113), which has an opening on the surface; and the diaphragm (111) which is provided on the surface so as to cover the opening of the hollow portion (113) and converts the vibration into the electrical signals. The semiconductor substrate (120) is formed as a part of the base (112).

Inventors:
INOUE DAISUKE
FUJII KYOKO
Application Number:
PCT/JP2010/001034
Publication Date:
October 21, 2010
Filing Date:
February 18, 2010
Export Citation:
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Assignee:
PANASONIC CORP (JP)
INOUE DAISUKE
FUJII KYOKO
International Classes:
G01F1/00; H01L29/84; G01L9/00; H04R19/04; H04R31/00
Foreign References:
JP2001508940A2001-07-03
JP2006270408A2006-10-05
JP2009054645A2009-03-12
JP2006237401A2006-09-07
Attorney, Agent or Firm:
NII, Hiromori (JP)
New house extensive 守 (JP)
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