COOLING DEVICE AND METHOD FOR MANUFACTURING COOLING DEVICE

WIPO Patent Application WO/2023/073877

A1

The present invention provides a device and a manufacturing method in which it is possible to adjust cooling performance in accordance with a subject being cooled.　This cooling device has a refrigeration cycle in which refrigerant is circulated between a heat-receiving unit (1), a compression unit (2) for compressing refrigerant that has received heat, and a heat-dissipating unit (3) for dissipating the heat of the compressed refrigerant, the cooling device comprising first header piping (4) for supplying the refrigerant that has received heat to the compression unit (2), and second header piping (5) for supplying the refrigerant from which heat has been dissipated to the heat-receiving unit (1). The first header piping (4) is provided with a plurality of first branch connection parts (6A) to which the heat-receiving unit (1) can be connected, and a plurality of second branch connection parts (6B) to which the compression unit can be connected. The second header piping (5) is provided with a plurality of third branch connection parts (7A) to which the heat-dissipating unit (3) can be connected, and a plurality of fourth branch connection parts (7B) to which the heat-receiving unit (1) can be connected.

MIYAMOTO YOSHINORI (JP)
YOSHIKAWA MINORU (JP)
CHIBA MASAKI (JP)
TODOROKI KOICHI (JP)
KOBAYASHI KENJI (JP)
HACHIYA MAHIRO (JP)

PCT/JP2021/039868

May 04, 2023

October 28, 2021

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NEC CORP (JP)

F25B5/02; F25B1/00; F25B6/02; F25B31/00; F25B41/40; F25B13/00

JPH10246526A	1998-09-14
JP2000035254A	2000-02-02
JPH06221620A	1994-08-12
JPH1114195A	1999-01-22

TANAI Sumio et al. (JP)

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