Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/209138
Kind Code:
A1
Abstract:
The present invention provides a cooling device which makes it possible, even when reduced in size, to prevent attachment of droplets of primary refrigerant sealed in a container onto a condensation pipe in the container, and to prevent dry-out of a liquid-phase primary refrigerant. The cooling device is provided with: a container to which at least one heating body is thermally connected; a primary refrigerant sealed in the container; and a condensation pipe which penetrates through a gaseous-phase portion in the container and in which a secondary refrigerant circulates. The heating body is thermally connected to a portion, or to a vicinity thereof, of an outer surface of the container in which the liquid-phase of the primary refrigerant is present. A container inner surface area-increasing portion for increasing the area of contact with the liquid-phase of the primary refrigerant is formed on an inner surface of the container to which the heating body is thermally connected. At least a portion of the container inner surface area-increasing portion is immersed in the liquid-phase of the primary refrigerant. A plate-like member is provided which includes a shielding portion positioned over the container inner surface area-increasing portion in the direction of gravity and under the condensation pipe in the direction of gravity, at least a part of the shielding portion not being immersed in the liquid-phase of the primary refrigerant. The plate-like member is provided with a support portion extending from the shield portion in a part of a periphery of the container inner surface area-increasing portion along an orthogonal direction to the direction of gravity.
Inventors:
AOKI HIROFUMI (JP)
INAGAKI YOSHIKATSU (JP)
KAWABATA KENYA (JP)
NAKAMURA YOSHINORI (JP)
INAGAKI YOSHIKATSU (JP)
KAWABATA KENYA (JP)
NAKAMURA YOSHINORI (JP)
Application Number:
PCT/JP2020/014737
Publication Date:
October 15, 2020
Filing Date:
March 31, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L23/34; F28D15/02; H01L23/427
Domestic Patent References:
| WO2011145618A1 | 2011-11-24 |
Foreign References:
| JPH0632409B2 | 1994-04-27 | |||
| JP2008522129A | 2008-06-26 | |||
| US20130105122A1 | 2013-05-02 | |||
| JP2014127539A | 2014-07-07 | |||
| JP2016054248A | 2016-04-14 | |||
| US20150109735A1 | 2015-04-23 |
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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