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Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/181343
Kind Code:
A1
Abstract:
This cooling device comprises a flow path through which a refrigerant flows, and a plurality of heat pipes. The heat pipes extend from the upstream side of the flow path toward the downstream side thereof, and are arrayed in a direction orthogonal to the direction in which the heat pipes extend. The heat pipes each have a casing that has an internal space in which a working fluid is disposed, and a sealing part that seals the working fluid in the internal space. At least one of the sealing parts is disposed on the upstream side of the flow path.

Inventors:
NISHIKAWA KAZUHIRO (JP)
HANANO MASAAKI (JP)
Application Number:
PCT/JP2022/005181
Publication Date:
September 01, 2022
Filing Date:
February 09, 2022
Export Citation:
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Assignee:
NIDEC CORP (JP)
International Classes:
F28F1/40; F28D15/02; H01L23/427; H01L23/473; H05K7/20
Domestic Patent References:
WO2011105364A12011-09-01
Foreign References:
JP2009198173A2009-09-03
JP2009024996A2009-02-05
JP2005180723A2005-07-07
JP2015038396A2015-02-26
JPH06209060A1994-07-26
EP2858464A12015-04-08
JP2020106245A2020-07-09
JP3170213U
JP3138847U2008-01-24
US20080035310A12008-02-14
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