Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/181344
Kind Code:
A1
Abstract:
This cooling device comprises a support plate opposite a heat source in an up-down direction, and a plurality of heat pipes. The heat pipes are disposed on the upper side of the support plate in the up-down direction. The heat source is disposed on the lower side of the support plate in the up-down direction. The heat pipes extend in a first direction orthogonal to the up-down direction, and are arrayed in a second direction orthogonal to the up-down direction and the first direction. At least one of the heat pipes which is positioned on the outer-most side in the second direction has an outer end portion extending in the first direction on the outside of the heat source in the second direction.
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Inventors:
NISHIKAWA KAZUHIRO (JP)
HANANO MASAAKI (JP)
HANANO MASAAKI (JP)
Application Number:
PCT/JP2022/005182
Publication Date:
September 01, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Foreign References:
| JP2020106245A | 2020-07-09 | |||
| JP3170213U | ||||
| JP2005114341A | 2005-04-28 | |||
| JP2001267772A | 2001-09-28 | |||
| JP2015038396A | 2015-02-26 | |||
| JP2018019599A | 2018-02-01 | |||
| JP2006278923A | 2006-10-12 |
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