Title:
COOLING STRUCTURE FOR ELECTRONIC APPARATUS AND SERVER PROVIDED WITH COOLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/196007
Kind Code:
A1
Abstract:
The present invention addresses the problem of improving cooling of a heat-generating component and a printed wiring board and to ensure the reliability of the mounted component and printed wiring board, the present invention providing a cooling structure which is provided with: a printed wiring board (201); a heat-generating component (202) mounted on the printed wiring board (201); a silicone thermally conductive material (402) that is placed between the printed wiring board (201) and a sheet-metal (401) and comes in contact with the printed wiring board (201); and a metal heat-dissipating component (404) that is placed on the sheet-metal (401) so as to have mobility in the horizontal direction and that comes in contact with the silicone thermally conductive material (402). The cooling structure dissipates the heat of the heat-generating component (202) and the printed wiring board (201), via the silicone thermally conductive material (402) and the heat-dissipating component (404), into the sheet-metal (401).
Inventors:
OTANI KENGO (JP)
TSUBAKI SHIGEYASU (JP)
TSUBAKI SHIGEYASU (JP)
Application Number:
PCT/JP2013/065392
Publication Date:
December 11, 2014
Filing Date:
June 03, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H05K7/20; H01L23/36
Foreign References:
| JP2010232318A | 2010-10-14 | |||
| JPH05160289A | 1993-06-25 | |||
| JP2006303374A | 2006-11-02 | |||
| JP2010503189A | 2010-01-28 |
Attorney, Agent or Firm:
OHGA, Shinji et al. (JP)
Heartly congratulation Shinji (JP)
Heartly congratulation Shinji (JP)
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