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Patent Searching and Data


Title:
COPOLYMER, AND RESIN COMPOSITION CONTAINING COPOLYMER
Document Type and Number:
WIPO Patent Application WO/2020/095774
Kind Code:
A1
Abstract:
Provided is an acrylic resin having photosensitivity for realizing photocurability, and having a superior low-refractive index. This copolymer has an acid value of 20 KOHmg/g or more, and is obtained through ring-opening addition performed on an epoxy group of an epoxy group-containing copolymer (P1) by using an unsaturated carboxylic acid (a-4), and adding a polybasic acid anhydride (a-5) to a hydroxyl group generated through ring-opening of the epoxy group. The epoxy group-containing copolymer (P1) contains: at least one structural unit selected from the group consisting of structural units derived from polymerizable monomers (a-1A) having a bridged cyclic hydrocarbon group having 10-20 carbon atoms, and structural units derived from polymerizable monomers (a-1B) represented by chemical formula (1); a structural unit derived from a fluorine-containing (meth)acrylate (a-2) represented by chemical formula (2); and a structural unit derived from an epoxy group-containing (meth)acrylate (a-3).

Inventors:
AOKI YUSUKE (JP)
KAWAGUCHI YASUAKI (JP)
Application Number:
PCT/JP2019/042472
Publication Date:
May 14, 2020
Filing Date:
October 30, 2019
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F8/14; C08F220/10; C08F220/22; C08F220/32; G02B5/20; G03F7/004; G03F7/038; H05K3/28
Domestic Patent References:
WO2012036183A12012-03-22
WO2013021650A12013-02-14
Foreign References:
JP2008287251A2008-11-27
JPH10253816A1998-09-25
JP2017032997A2017-02-09
JP2007119572A2007-05-17
JP2012109514A2012-06-07
JPS61258813A1986-11-17
JP2005008857A2005-01-13
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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