Title:
COPPER OR COPPER ALLOY TARGET/COPPER ALLOY BACKING PLATE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2005/064036
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a copper or copper alloy target/a copper alloy backing plate assembly wherein the copper or copper alloy target combines the resistance to an eddy current and the other characteristics required to a magnetron spattering target in good balance. [MEANS FOR SOLVING PROBLEMS] A copper or copper alloy target/a copper alloy backing plate assembly for use in magnetron sputtering, wherein the copper alloy backing plate comprises a low beryllium copper alloy or a Cu-Ni-Si based alloy; and a copper or copper alloy target/a copper alloy backing plate assembly, wherein the copper alloy backing plate has an electroconductivity of 35 to 60 % (IACS) and a 0.2 % yield strength of 400 to 850 MPa.
Inventors:
OKABE TAKEO (JP)
MIYASHITA HIROHITO (JP)
MIYASHITA HIROHITO (JP)
Application Number:
PCT/JP2004/017744
Publication Date:
July 14, 2005
Filing Date:
November 30, 2004
Export Citation:
Assignee:
NIKKO MATERIALS CO LTD (JP)
OKABE TAKEO (JP)
MIYASHITA HIROHITO (JP)
OKABE TAKEO (JP)
MIYASHITA HIROHITO (JP)
International Classes:
C23C14/34; H01J37/34; (IPC1-7): C23C14/34; C22C9/00; C22C9/06
Foreign References:
| JPH0379734A | 1991-04-04 | |||
| JPH01180975A | 1989-07-18 | |||
| JPH11236665A | 1999-08-31 | |||
| JP2001329362A | 2001-11-27 |
Other References:
KOSHIBA Y. ET AL: "Mitsubishi material's high performance oxygen free copper and high performance alloys", SECOND INTERNATIONAL CONFERENCE ON PROCESSING MATERIALS FOR PROPERTIES, 2000, pages 101 - 104, XP002986928
See also references of EP 1715077A4
See also references of EP 1715077A4
Attorney, Agent or Firm:
Ogoshi, Isamu (2-2 Atago 1-Chome, Minato-k, Tokyo 02, JP)
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