Title:
COPPER ALLOY FOR ELECTRONIC EQUIPMENT AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/004645
Kind Code:
A1
Abstract:
A copper alloy for electronic equipment, characterized in that the work-affected layer constituting the surface layer thereof has a thickness of 0.2 μm or less; and a process for producing the same.
Inventors:
UNO TAKEO (JP)
SUGAWARA CHIKAHITO (JP)
MIHARA KUNITERU (JP)
SUGAWARA CHIKAHITO (JP)
MIHARA KUNITERU (JP)
Application Number:
PCT/JP2006/313305
Publication Date:
January 11, 2007
Filing Date:
July 04, 2006
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/02; C22C9/04; C22C9/06; C22F1/08; C22F1/00; C22F1/02
Foreign References:
| JPH09111500A | 1997-04-28 | |||
| JP2003089832A | 2003-03-28 | |||
| JPS63230884A | 1988-09-27 | |||
| JPH03215688A | 1991-09-20 | |||
| JPH08319527A | 1996-12-03 | |||
| JPS6396232A | 1988-04-27 | |||
| JPS63118051A | 1988-05-23 | |||
| JPH1129894A | 1999-02-02 | |||
| JPS63266050A | 1988-11-02 |
Attorney, Agent or Firm:
IIDA, Toshizo (1-10 Shimbashi 3-chome, Minato-k, Tokyo 04, JP)
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