COPPER ALLOY MATERIAL FOR ELECTRONIC OR ELECTRIC EQUIPMENT PARTS

Title:

COPPER ALLOY MATERIAL FOR ELECTRONIC OR ELECTRIC EQUIPMENT PARTS

Document Type and Number:

WIPO Patent Application WO/2002/008479

Kind Code:

A1

Abstract:

A copper alloy material for electronic or electric equipment parts which comprises 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.0 1 to 0.2 mass % of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn and less than 0.005 mass % (including 0 %) of S, the balance of the alloy being Cu and inevitable impurities, and has a specific crystal grain diameter and a specific ratio of the longer diameter of a grain in a cross section parallel with the direction of a last plastic working to the longer diameter of a grain in a cross section perpendicular to the direction of the last plastic working, and/or a specific surface roughness after the last plastic working.

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Inventors:

USAMI TAKAYUKI (JP)
HIRAI TAKAO (JP)

Application Number:

PCT/JP2001/004351

Publication Date:

January 31, 2002

Filing Date:

May 24, 2001

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
USAMI TAKAYUKI (JP)
HIRAI TAKAO (JP)

International Classes:

B32B15/01; B32B15/20; C22C9/02; C22C9/04; C22C9/06; H01H1/025; H01R13/03; (IPC1-7): C22C9/05; C22C9/04

Foreign References:

JPH11222641A	1999-08-17
JPH11256256A	1999-09-21
JPH0559468A	1993-03-09
JPH01180932A	1989-07-18
JPH06100983A	1994-04-12

Other References: