The proposed system of modules is designed for applying coatings to the substrates, for instance, kinescopes, flat displays, etc. and may be used as a continuously operating system for deposition of various thin-film systems on the substrates having similar or different standard sizes, for example, kinescopes or flat displays of 14", 17", 19", 21"in size and so forth.

The method and apparatus for applying thin-film coatings to the outer surface of a kinescope (cathode-ray tube (CRT)) after it has been assembled are known.

A deposition chamber in the prior art apparatus comprising a differential evacuation system consists of a deposition zone and an evacuation zone.

During the operation of the apparatus, the pressure in the deposition zone is within the range from 1 10-1 to 810-1 Pa and the pressure in the evacuation zone is within the range from 5 10-3 to 7 10 Pa.

The CRTs mounted on substrate carriers are transported along the vacuum chamber. The substrate carriers are provided with barrier plates dividing the vacuum chamber volume into two zones, i. e. a deposition zone and an evacuation zone. A conducting coating in the prior art apparatus is vacuum-deposited, for instance, using magnetron sputtering, onto the part of the surface that is adjacent to a bandage belt or to other grounded section of a CRT screen to facilitate the elimination of surface electrostatic charges. [1].

The prior art apparatus, however, has significant disadvantages.

Firstly, the apparatus, being a sequential processing device, is characterized by a low performance.

Secondly, transporting the assembled CRT within the vacuum chamber does not prevent various types of dirt and impurities from reaching the surface to be coated from the surface of structural components, and hence, does not ensure the required coating quality.

Thirdly, since the in-line CRT coating process is arranged in a continuous and sequential manner, any failure of individual units of the system leads to a complete stop

thereof. This implies that the apparatus has a low reliability and serviceability reducing the performance thereof.

Fourthly, any preventive and adjustment operation lead to a complete shutdown of the production process as a whole.

Fifthly, reducing energy consumption per one CRT coated with a deposited material proportionally to the system performance is not possible, since the operation of all units and subsystems is required for the whole system to operate.

A vacuum deposition apparatus comprising a vacuum chamber having an opening designed for positioning a substrate, a sealing member and a processing coating device designed for applying coatings is also known.

The construction comprises a valve gate mounted in the plane parallel to the plane of the vacuum chamber opening and designed for separating the part of the chamber space, where a deposition source is disposed, from the part of the chamber space having the opening.

Therefore, a deposition source-transporting mechanism transports the source in the plane perpendicular to the plane, in which the substrate is positioned, i. e. it brings alternately the deposition source to the substrate to place the former in the operating position and withdraws it there from [2].

The prior art apparatus, however, has certain disadvantages.

Firstly, transporting the deposition source in the direction perpendicular to the substrate plane only does not allow to provide homogeneity and uniformity of the coating thickness on the substrates, the cross-sectional dimension of which is greater than the distance from the substrate surface to the deposition source.

Secondly, said apparatus does not allow to perform a finish ionic cleaning of the substrate surface.

Thirdly, the prior art apparatus presents difficulty in using an optical or quartz control of the coating depth, and, as a result, reproducibility of processes of coating multi- layer film structures on a CRT or flat display surface is not possible.

It is the aim of the present invention to improve the quality, homogeneity and uniformity of thin-film coatings on the substrate surface, to ensure purity of the coating to be applied, to expand functional and processing capacities of the apparatus, to provide a continuous coating process on the substrates and a fast replacement of already coated substrates by the unprocessed ones.

To attain the aim, in a vacuum module for coating on a substrate comprising a vacuum chamber having an opening designed for positioning the substrate, a sealing

member and a processing device designed for applying coatings, a valve gate mounted in the plane parallel to the plane of the vacuum chamber opening and designed for separating the part of the chamber space having the processing device from the opening, and a processing device-transporting mechanism, according to the invention (variant 1), the processing device-transporting mechanism is mounted so that it can move in a reciprocating manner parallel to the substrate surface.

Furthermore, according to the invention (variant 2) the vacuum chamber has at least two openings for positioning substrates, with the processing device being mounted to provide a reciprocating motion parallel to the substrate surface.

According to one more variant of the invention (variant 3), the vacuum chamber is additionally fitted with a cover designed for positioning a substrate, while the processing device-transporting mechanism is mounted in such a manner that it can move in a reciprocating manner parallel to the substrate surface.

The above mentioned aims are also attained by providing a system of modules for applying coatings to a substrate, which system is claimed as an invention, comprising at least two vacuum modules constructed according to any of proposed variants and having a common vacuum pumping system, wherein, according to the invention, the modules have a common pumping control system, a common handling-device control system having process sensors designed for automatic loading-unloading the substrates, with at least of a group of modules being disposed within the range of operation of a common manipulator.

In the variants of modules being provided as an invention, the perimeter of the vacuum chamber openings matches the contour of the surface to be coated.

The modules may be further provided with substrate carriers designed for holding the substrates, while the former may be constructed without openings, with one opening or with plurality of openings.

The substrates may be positioned both on the surface of a substrate carrier and on the openings made on the substrate carrier surface, and in this case the substrate carrier proper may be constructed removable.

To hold the substrate, the substrate carrier may be disposed outside the module and, hence, ensure a safe transportation of substrates from one place to another and subsequent positioning thereof on the module.

In case the substrate carrier is disposed either within a zone of an opening or openings of the module vacuum chamber, or within the zone of the vacuum chamber cover, the former having sealing members disposed along the perimeter thereof allows for not only holding the substrates, but also sealing them.

In this case, the substrate carrier is disposed parallel to the plane of motion of the. processing device. Therefore, the substrate carrier opening perimeter invariably matches the contour of the surface to be coated, and in case the substrate carrier is provided with at least one opening to position the substrate, the substrate carrier opening parameter must invariably match the contour of the surface to be coated, while the substrate carrier opening must be provided with at least one sealing member mounted along the perimeter thereof and designed for holding the substrate.

In case the vacuum chamber, substrate carrier and/or cover are constructed with two or more openings, all of them are provided with one or several individual additional valve gates for each opening mounted in the plane parallel to the substrate positioning plane, and with sealing members the number of which is defined by the number of openings in the vacuum chamber, substrate carrier or cover.

Furthermore, in a particular case a cover and/or substrate carrier, which may not have openings for positioning the substrates, may be used. In this case, small-size substrates are held on the inside of the cover and/or substrate carrier, facing inward the vacuum chamber. Substrates together with substrate carriers may be held to the vacuum chamber cover, if required. Therefore, the cover itself may serve as a substrate carrier.

In all module variants the processing device-transporting mechanism may be constructed in the form of a carriage.

Processing components disposed on the carriage are configured by selecting them from a group of components comprising evaporators, magnetron cathodes, glow discharge targets, an ionic cleaning system and an ion-sputtering system having a rotary prism, with the rotary prism being mounted parallel to the plane of the vacuum chamber opening and at least one working face thereof being provided with the material to be sputtered.

In this case the processing components are constructed replaceable, and a set . thereof on a processing device is defined by the required processing steps and the material to be sputtered.

In addition, like the substrate carrier, the vacuum chamber cover may have one opening or at least two openings, with sealing members designed for holding the substrates being mounted along the perimeter thereof.

According to the invention, the cover may be constructed removable and/or replaceable and have different parameters of openings for mounting substrates of various standard sizes. The cover can be used as a substrate carrier and disposed parallel to the motion plane of the processing device mounted with a capability of moving in a

reciprocating manner parallel to the surface of substrates positioned in openings made in the vacuum chamber cover.

The construction of the vacuum module and variants of embodiment thereof have essential advantages compared to those of conventional apparatuses used for similar applications.

Thus, for instance, the processing device-transporting mechanism mounted to move reciprocally parallel to the substrate surface allows to deposit a thin film coating of actually any size to the substrate, which is also conditioned by the sizes of an opening (variant 1) or openings (variant 2) of the vacuum chamber, the substrate carrier and/or cover, and furthermore, allows for reaching coating thickness homogeneity and uniformity by smoothly and rhythmically scanning the surface to be coated.

Matching the perimeter of openings provided in the vacuum chamber, substrate carrier and/or cover to the contour of the deposition surface, allows a high-quality thin-film deposition on the substrate surface to be performed, with the whole area of deposition surface being processed with a high-degree accuracy.

Furthermore, the openings in the replaceable covers and/or substrate carriers can have different sizes and, hence, they can be used for positioning substrates with different standard sizes, for instance, CRT or flat displays (for example, 14", 17", 19", and 21").

No openings may be provided in the substrate carrier and/or cover disposed in the zone of the vacuum. chamber openings parallel to the motion plane of the processing device. This allows substrates of a smaller size to be held on the surface thereof facing inward the vacuum chamber, increasing thereby the module multifunctionality, while maintaining a high quality of thin films deposited on the substrate surface.

The openings made in the substrate carrier and/or cover also allow for simultaneously processing substrates of different standard sizes, thereby improving the performance of the vacuum module and expanding functional capabilities thereof and ensuring a high-quality coating on the substrate surface since the parameter of these openings matches the contour of the surface to be coated.

The sealing members disposed in the openings of the vacuum chamber, substrate carrier or cover ensure tight setting of substrates to the opening, thereby providing sealing and high quality of deposition thin films on the substrate surface.

Since the substrate carrier and/or cover may be constructed removable, this additionally ensures the multifunctionality of the module.

In this case, the module cover is disposed parallel to the motion plane of the processing device.

The processing device is mounted so that it can move reciprocally parallel to the substrate surface. Such a relative arrangement of the cover, substrates and processing device ensures not only vacuum module multifunctionality, but also high quality of coatings applied to substrates having an extensive range of standard sizes.

The transporting mechanism constructed according to the invention allows a continuous process to be actually performed during deposition of coatings of different materials or oxides thereof or other materials on the substrate surface.

Fig. I shows a general view of the vacuum module described as in variant 1 ; Fig. 2 shows a general view of the vacuum module described as in variant 2; Fig. 3 shows the substrate carrier where A is a substrate carrier without an opening, B has one opening, C has two openings; and the vacuum module cover, where D is a cover without an opening, E has one opening, F has two openings; Fig. 4 shows a general view of the processing device- transporting mechanism constructed in the form of a carriage mounting processing components, where A is the carnage proper with a ion-sputtering source and a rotary prism, B are processing components mounted on the carriage; Fig. 5 shows a general view of the vacuum system for applying thin-film coatings.

A vacuum module for applying coatings to the substrate according to the first variant (Fig. 1) comprises a vacuum chamber 1 having an opening 2 designed for positioning a substrate 3; a sealing member 4 and a processing device 5; a valve gate 6 mounted in the plane parallel to the plane of the opening 2 of the vacuum chamber 1 and designed for separating a part of space of the chamber 1 having the processing device 5 from the opening 2; and a mechanism 7 for transporting the processing device 5.

It should be noted that the mechanism 7 for transporting the processing device 5 is mounted to move reciprocally parallel to the surface of the substrate 3.

Unlike the first variant, a vacuum module as described in the second variant (Fig. 2.) is provided with at least two openings 2,8 for positioning substrates 3 (3'), with the processing unit 5 being mounted with a capability of moving reciprocally parallel to the surface of the substrates 3 (3').

A vacuum module according to the third variant, in distinction to the first two variants, comprises a cover 9 (Fig. 3, D, E, F) designed for positioning substrates 3 (3'), and a mechanism 7 for transporting a processing device 5, which is mounted to move reciprocally parallel to the surface of said substrates.

The modules constructed by any of said variants may be provided with a substrate carrier 10, which may be disposed outside the zone of vacuum chamber openings and even

outside the module, thereby ensuring in this case substrate holding and safe substrate transportation from one place to another.

In other cases, a substrate carrier may be disposed within the zone of the opening 2 or openings 2,8 of the vacuum chamber 1 and may be designed without openings or at least with one opening 11 or two openings 11, (11') (Fig. 3, A, B, C) to position substrates 3 (3'), and with sealing members 12 (12') disposed along the perimeter of openings 11 (I I') and designed for holding substrates 3 (3'). Besides, the substrate carrier 10 may be made removable.

The openings 2,8 of the vacuum chamber 1 having sealing members 4,4'allow the substrate carrier 10 to be tightly set and held to the openings 2,8 of the vacuum chamber 1.

The perimeter of the opening 11 (or openings 11, 11') of the substrate carrier 10 matches the contour of the surface to be coated, and the substrate carrier 10 proper is mounted parallel to the motion plane of the processing device 5.

In the third variant of the vacuum module, the cover 9 of the vacuum chamber 1, like the substrate carrier 10, may be constructed without openings or may have one opening 13 or two openings 13 and 14 and may be provided with sealing members 12a and 12b to fix and seal substrates 3 and 3'positioned on the openings 13 and 14 and be made removable (Fig. 3, D, E, F).

In this case, sealing members 12a and 12b are mounted on openings 13 and 14 of the cover 9 precisely along the contour of the said openings.

Besides, the cover 9 may be used either as the substrate carrier 10 or for disposing the substrate carrier 10 and substrates thereon. In this case, the cover is mounted parallel to the motion plane of the processing device 5.

Like in two above mentioned vacuum module variants (first and second), the sealing elements 4,4'ensuring a tight setting and holding of the cover 9 are mounted along the perimeter of the opening 2 or openings 2,8 of the vacuum chamber 1 matching the contour of the surface to be coated in the third embodiment.

In cases the module variants, for example, provide for two or more openings in the vacuum chamber 1 (variant 2) or in the vacuum chamber cover 9 (variant 3), the vacuum chamber may be provided with an additional individual gate 15 for each opening to be mounted in the plane parallel to the substrate positioning plane.

In the first, second and third variants of the module, the perimeters of the openings made either in the vacuum chamber 1 or in the substrate carrier 10 (variants 1, 2,3) or in the cover 9 (variant 3) must optimally match the contours of surfaces to be coated, and the sealing members mounted on these openings must match contours of said openings.

Besides, all module variants involve using a carriage 16 as the mechanism 7 for transporting the processing device 5 comprising processing components.

The configuration of processing components on the carriage is selected from the group comprising evaporators 17, magnetron cathodes 18, cathode-sputtering targets 19, an ionic cleaning system 20 and an ion-sputtering system 21 having a rotary prism 22, with the rotary prism 22 being installed parallel to the plane of the opening of the vacuum chamber 1 and at least one working face 23 thereof being provided with a material to be sputtered (Fig. 4).

Besides, all processing components 17,18,19,20,21,22 and 23 are made replaceable and the set thereof on the processing device is conditioned by the required processing steps and the material to be sputtered.

The module (in all three variants) is also provided with a gas/water/power supply system 24 (Fig. l) and optical 25 and quartz 26 devices for controlling the thickness of deposition of films (Fig. 2) and, in addition, with a forepump 27 and a diffusion pump 28 (Fig. 1) and, optionally with an additional forepump 29 (Fig. 2).

The vacuum module is also provided with valves VI, V2, V3 and V4 and a drive Cl, with the valves V1, V2, V3 and V4 serving to connect the pumps 27,28 and 29 to the vacuum chamber 1, and the drive Cl (Fig. l) is used for opening and shutting the gate 6 or gates 6,15 (Fig. 2).

Fig. 5 illustrates a system of modules for coating on a substrate in the automatic mode of loading-unloading of substrates 3 (3') comprising, for example, two vacuum modules 30,31 constructed according to any of three variants.

The said modules are provided with a common evacuation system 32, process sensors 33, common evacuation control system 34, a common handling-device control system 35 comprising a transporter 36 and a common manipulator-loader 37 and designed for the automatic loading-unloading of substrates 3 (3'), as well as with evacuation stations 38,39. It should be noted that said modules are disposed within the operating zone of the common manipulator-loader 37.

A high-vacuum module (variant 1), being proposed as an invention, operates in the manner described below.

When initially turned on, the diffusion pump 28 is evacuated via the opened valve V3 using the forepump 27 until the former is fully heated and forced into the operation mode.

Then the vacuum chamber 1 is evacuated down to a specific pressure via the valve 2 using the forepump 27. The valve gate 6 is closed in an initial state and separates a part

of the space of the vacuum chamber 1, in which the processing device 5 is disposed from the opening 2.

Once the required pressure reached, the valve V2 is closed and the diffusion pump 28 is connected to the space of the vacuum chamber 1 to produce the required vacuum pressure therein.

Simultaneously, the substrate 3 (for example, a front CRT surface) is positioned on . the elastic sealing member 4 mounted on the opening 2 of the vacuum chamber I or on the sealing member 12 mounted on the opening 11 of the substrate carrier 10, then the valve V 1 opens and the space defined by the front surface of the substrate with the elastic sealing member and a gate 6 is evacuated using the forepump 27. Once the required pressure reached, the valve V I is closed and the gate 6 is opened using the drive C1, for example, a pneumatic cylinder (not shown in the drawing).

After some time, pressure in the whole vacuum chamber 1 at first is balanced, and then reaches the preset value.

Once the required pressure is reached, the technological process of coating on the substrate actually starts.

For this purpose, a working gas, generally Ar or Oz, is fed to the ionic cleaning system 20 through the gas/water/power supply system 24 (Fig. 1) at the initial process stage and the mechanism 7 made, for example, in the form of the carriage 16, for transporting the processing device 5 is turned on.

The processing device 5 mounts the processing components 17,18,19,20,21, 22 and 23 (Fig. 4), which are required for performing a specific process related to deposition of a specific material on the substrate front surface.

A high voltage is supplied to the ionic cleaning system 20 and within a specific time interval the surface of the substrate 3 is exposed to gas-discharge ions. Upon termination of this interval, the supply unit and the working gas-supply control system feed an argon-oxygen mixture into the gasmain to achieve a specific pressure in the vacuum chamber 1.

Then, an ionic current is supplied to the rotary prism 22 from the ion-sputtering source 21 and one of the materials placed on the faces 23 of the prism 22 is sputtered on the substrate 3.

In this case, the carriage 16 or any other mechanism 7 for transporting the processing device 5 moves reciprocally parallel to the surface of the substrate 3.

During the time interval of deposition of the first layer on the front surface of the substrate 3, the devices indicating termination of the process, in particular, optical 25 and

quartz 26 control sensors (Fig. 2) turn on, and once the signals read the required values on the indicating devices, the process of deposition of the first layer stops.

After de-energizing and cutting off the gas mixture supply, the prism 22 rotates to the position one of the faces 23 thereof, on which another material is also placed.

The argon-oxygen gas mixture is fed to the ion-sputtering system 21, high voltage is supplied and a gas discharge is ignited. Then, while the carriage 16 is in the moving mode, the material, in particular, an oxide composite is sputtered and deposited on the surface of the substrate 3 during a specific time interval.

The second layer deposition is terminated, when the signal reaches the preset values on indicating devices, i. e. on optical 25 and quartz 26 control sensors.

Further, the process of deposition of the first and second layers on the substrate 3 is repeated as many times, as required.

In other cases, combinations of materials to be deposited on the substrate surface may be different and include both pure metals placed on some working faces 23 of the rotary prism 22 and the oxides and nitrides thereof or other compounds placed on other working faces 23 of the rotary prism 22.

For this purpose, the necessary gases are fed to the processing components 17,18, 19,21,22,23 and the ionic cleaning system 20 of the processing device (Fig. 4) through the gas/water/power system 24 (Fig. 1).

Depending on the purpose of application of film layers, not only optical 25 (reflection and transmission) and quartz 26 control sensors, but combinations thereof, may be used as indicating devices.

To ensure the maximum homogeneity of the substrate 3 surface coating at a minimum scanning scope, a specially developed software program is used that is designed to supply computer control commands to perform scanning by the carriage 16 with processing components 17, 18,19,20,21,22 and 23 disposed thereon relative to the substrate 3.

As a result, alternate oxide and metal coatings are formed on the substrate 3 surface. A conduction of metal layers ensures low specific resistivity, while the use of oxides reduces the reflection factor of the substrate 3 front surface.

Once the coating process on the substrate 3 is completed, the valve gate 6 is closed and air is fed into the space beneath the substrate, then the substrate 3 is removed from the opening 2 of the vacuum chamber 1 and replaced by a new substrate. In this case, the processing device 5 mounting processing components remains in a high-vacuum zone.

After placing the new substrate, the cycle is repeated.

It is noteworthy, that processing components of the processing device 5, which arc continuously exposed to a high-vacuum environment, operate without preventive cleaning and repair for a long time. Besides, pilling of the deposited off the vacuum chamber walls and tooling, as well as fouling of the processing components thereby is not observed.

To ensure the operation of the module constructed according to variant 2, wherein the vacuum chamber 1 is provided with at least two openings 2 and 8 and the processing device 5 moves reciprocally parallel to the surface of substrates 3 and 3', the former is provided with an additional forepump 29, continuously evacuating the diffusion pump 28 via the valve V3, allowing thereby the module to reach faster the operating readiness.

When the module (Fig. 2) having two operating openings 2 and 8 and gates 6 and 15 is initially energized, the spaces of the vacuum chamber 1 between the substrates 3 and 3' and valve gates 6 and 15 are alternately evacuated via the valves VI and V4 using the forepump 27.

The gates 6 and 15 are closed in the initial state and separate the spaces of the vacuum chamber 1 from openings 2 and 8. Upon reaching the operating readiness by the module, the substrate 3 is positioned on the sealing member 12 (Fig. 2) of the opening 2 of the vacuum chamber 1. The space between the gate 6 and substrate 3 is evacuated via the valve V 1 with the forepump 27.

Once the specific pressure is reached in the said space of the vacuum chamber 1, the gate 6 opens and the coating process on the substrate 3 starts.

For this purpose, the transporting mechanism 7 made, for example, in the form of the carriage 16 and having a set of processing components 17,18,19,20,21,22 and 23 disposed thereon, scans the surface of the substrate 3 in a zone of the opening 2 for deposition alternately the required number of layers to the surface thereof, in the similar manner as described above.

While the substrate 3 placed on the opening 2 of the vacuum chamber I is exposed to a coating process, the second substrate is positioned on the second opening 8 with the sealing member 12' (Fig. 2) and the space of the vacuum chamber 1 defined by the gate 15 and the second substrate is evacuated via the valve V4 using the forepump 27.

By the time the coating process on the substrate 3 is completed, the required pressure is produced beneath the second substrate placed on the opening 2 of the vacuum chamber 1.

Once the coating process on the substrate 3 is terminated, the valve gate 6 closes, the substrate 3 is replaced and the vacuum gate 15 opens immediately, the carriage 16 having processing components disposed thereon starts scanning the surface of the second

substrate positioned in the zone of the opening 8 of the vacuum chamber I for deposition alternately the necessary number of layers to the surface thereof by the above described . process.

Therefore, in said second module variant, processing components continuously operate in the necessary configuration and perform the alternate coating process first on the substrate placed in the zone of the opening 2 and then on the second substrate placed in the zone of the opening 8.

The said module variants also provide for the application of the substrate carrier 10 mounted on the sealing member 4, (4') ensuring that the substrate carrier is tightly set and held to the opening 2 or openings 2,8 of the vacuum chamber 1.

In this case, the substrate carrier 10 (Fig. 3, A), for example, not having openings is mounted parallel to the motion plane of the processing device 5, and small-size substrates are held to the surface thereon facing inward the vacuum chamber 1.

The coating process on the surface of the said substrates is performed in the manner described above.

In case the substrate carrier 10 is disposed outside the module, it serves as a fixing member of a substrate on the surface thereof or on openings made therein and facilitates the transfer and positioning of the substrates on the module to coat their surface.

Alternatively, the substrate carrier 10 may be made removable and provided with at least one opening 11 (11') having a sealing member 12 (12'), on which the substrate 3 (3') is positioned and the coating process thereto is performed in a manner similar to above described process.

In the third variant of the module, it comprises a cover 9 designed for positioning a substrate and the processing device-transporting mechanism 5 is mounted in such a way as to allow it to move reciprocally parallel to the surface of the substrate placed in the cover 9 of the vacuum chamber 1.

In said module variant, the cover 9 may be made removable and used as the substrate carrier 10. Like in the second module embodiment, small-size substrates may be -held to the surface of the cover 9 made without openings and facing inward the vacuum chamber 1, and the coating process on the surface of the said substrates is performed according to the process described above herein.

Besides, one opening 13, two openings 13,14 or more openings designed for positioning of one, two or more large-size substrates being fixed with sealing members may be made in the cover 9.

The coating process on the substrate or substrates is performed using the method described for the first and second variants of the modules.

Specific embodiment of the thin-film coating process on the face glass surface of a CRT (substrate) using the vacuum module constructed according to any of the proposed variants.

A vacuum module constructed according to variant 1 operates in the following manner and in the following modes for coating on the front glass surface of a CRT.

Initially, a diffusion pump 28 is evacuated via the opened valve V3 using a forepump 27 until the former is heated and forced into the operating mode.

Then a vacuum chamber 1 is evacuated via the valve V2 with the forepump 27 down to the pressure ~6-10 Pa. A valve gate 6 is closed in the initial state and separates a part of a space of the vacuum chamber 1 having a processing device 5 from an opening 2.

Once the said pressure is attained, the valve V2 closes and the diffusion pump 28 connects to the space of the vacuum chamber 1 and produces the pressure 1-3-10' therein.

The front glass surface of the CRT is placed on an elastic sealing member 4 disposed on the opening 2 of the vacuum chamber 1. Then the valve VI is opened and a pressure 10 Pa is produced in the space defined by the CRT front glass surface and the gate 6 using the forepump 27. Once the said pressure is reached, the valve V1 closes and the gate 6 is opened with the drive C l of a pneumatic cylinder (not shown in the drawing).

After 30 seconds, the pressure at first is balanced throughout the space of the vacuum chamber 1 and then reaches the value of ~8-101 Pa. Upon reaching the said pressure, the coating process on the front glass surface of the CRT actually starts.

For this purpose, a working gas, generally Ar or Os, is fed to the ionic cleaning source 20 at the first process stage, and a transporting mechanism 7 made in the form of a carriage 16 mounting an ionic cleaning source 20 and an ionic sputtering source 21 with a rotary prism 22 having a metal placed on one of the faces 23 thereof and a metal oxide on the other one (Fig. 4) is turned on.

High voltage from 2 to 2.5 kV is supplied to the anode of the ionic cleaning source 20, and the kinescope glass surface is exposed to gas-discharge ions for 0.5-1 minute, thereby fully cleaning the said surface from any impurities.

After a lapse of that time, an argon-oxygen gas mixture is fed to the gas main of the gas/water/power system 24 using the power supply unit and the working gas feeding- control system to reach the pressure of 7-8, 5-10'Pa in the vacuum chamber 1.

Then the ionic current of 0.4 to 0.6 A is supplied to the rotary prism 22 from the ionic sputtering source 21 and the metal, for example In-Sn placed on one of the faces 23 of the rotary prism 22 is deposited on the CRT glass surface for one minute.

In doing so, the carriage 16 having processing components disposed thereon moves reciprocally parallel to the CRT glass surface.

During the time interval of deposition of the first layer on the CRT front glass surface, the end-of-process indicating devices, in particular, optical 25 and quartz 26 control sensors (Fig. 2) turn on, and once the signals read the required values on the indicating devices, the process of deposition the first layer stops.

After de-energizing and cutting off a gas mixture supply, the prism 22 rotates with another face, on which another material is placed.

The argon-oxygen gas mixture is fed to the ion-sputtering source 21, high voltage of 2000-3500 V is supplied and a gas discharge is ignited by a current-0. 3-0.4A, under the action of which the second layer, in particular an oxide of the second metal, for example, Si02 is sputtered on the CRT glass surface for 1-2 minutes, while the carriage 16 is moving reciprocally parallel to this CRT surface.

The second layer deposition is terminated, when the signal reaches the designed values on indicating devices, i. e. optical 25 and quartz 26 control sensors.

Further the process of coating the first and second layers on the substrate 3 is repeated as many times, as required by the coating ion process.

In other cases, combinations of materials to be deposited on the substrate surface may be different and include both pure metals, placed on different working faces 23 of the rotary prism 22, and oxides and nitrides thereof or other compounds.

For this purpose, the necessary gases are fed to the processing components 18,19, 21,22 and the ionic-sputtering source 20 of the processing device 5 through the gas/water/power supply system 24.

Depending on the purpose of application of film layers, not only optical (reflection and transmission) and quartz control sensors, but combinations thereof, may be used as indicating devices.

To ensure a maximum homogeneity of the CRT surface coating at a minimum scanning scope, a specially developed software program is used designed to supply computer control commands to perform scanning by the carriage 16 with processing

components 17, 18,19,20,21,22 and 23 disposed thereon relative to the CRT surface to be coated.

As a result, an alternate oxide and metal coating is formed on the front CRT glass surface. A conduction of metal layers ensures low specific resistivity, namely-10 Ohm/cm2, while the use of oxides reduces the reflection factor of the fi-ont CRT glass surface from initial 6.5% to ~1. 5%.

Once the process of coating on the CRT glass surface is completed, the valve gate 6 is closed and air is fed into the space beneath the CRT, then the CRT is removed from the opening 2 of the vacuum chamber I and replaced by a new one. In this case, the processing device 5 mounting processing components remains in a high-vacuum zone.

After placing a new CRT, the cycle of coating on the surface is repeated.

It is noteworthy that processing components of the processing device 5, which are continuously exposed to a high-vacuum environment, operate without preventive cleaning and repair for a long time. Besides, pilling of the deposited materials off the vacuum chamber walls and tooling, as well as fouling of the processing components thereby is not observed.

To ensure the operation of the module constructed by embodiment 2, in which the vacuum chamber 1 is provided with at least two openings 2 and 8 and the processing device 5 moves reciprocally parallel to the surface of substrates positioned on the said openings, the former is provided with an additional forepump 29, continuously evacuating the diffusion pump 28 via the valve V3, thereby allowing the module to reach faster the operating readiness.

When the module (Fig. 2) having two operating openings 2 and 8 and gates 6 and 15 is initially energized, the vacuum chamber 1 is preliminary evacuated by the forepump 27 via the valve V2, then the latter alternately evacuates the spaces of the chamber I between the CRT, positioned on openings 2 and 8, and the valve gates 6 and 15 via the valves VI and V4.

The gates 6 and 15 are closed in the initial state and separate the spaces of the vacuum chamber 1 from openings 2 and 8. Upon reaching the operating readiness by the module, the first CRT is positioned on the sealing member 12 (Fig. 2) of the opening 2 of the vacuum chamber 1. The space between the gate 6 of the vacuum chamber I and the face glass surface of the CRT is evacuated via the valve VI using the forepump 27.

Once a specific pressure of-1-10 Pa is reached in the said space of the vacuum chamber 1, the gate 6 opens and the process of coating on the CRT surface starts.

For this purpose, the carriage 16 having a set of processing components 17,18,19, 20,21,22 and 23 disposed thereon, scans the surface of the CRT in the zone of the opening 2 and deposits alternately the required number of layers on the surface thereof using the process as described above.

While the CRT glass surface placed on the opening 2 of the vacuum chamber 1 is exposed to a coating process, the second CRT 3'is positioned on the second opening 8 with the sealing member 12' (Fig. 2).

Then the space of the vacuum chamber 1 defined by the gate 15 of the vacuum chamber 1 and the face glass surface of the second CRT (3') positioned on the opening 8 is evacuated via the valve V4 using the forepump 27.

By the time the process of coating on the surface of the first CRT 3 positioned on the opening 2 of the vacuum chamber 1 is completed, the pressure of-1-10 Pa is produced beneath the second CRT 3'.

Once the process of coating on the surface of the first CRT is terminated, the valve gate 6 closes, the first CRT is replaced by the next one and the vacuum gate 15 opens immediately.

At that time, the carriage 16 having a set of processing components disposed thereon starts scanning the surface of the second CRT positioned in the zone of the opening 8 applying alternately the necessary number of layers to the face surface thereof by the above described process.

Therefore, in the said second module variant, processing components are in a continuous operation applying the coating in an alternate manner first to the substrate 3 placed in the zone of the opening 2 and then to the second substrate 3'placed in the zone of the opening 8.

Providing a substrate carrier 10 as in all variants of the vacuum module and also a cover 9 as in the third embodiment of the module significantly expands functional capabilities of the subject being claimed and allows thin-film coatings to be applied not only to large-size surfaces, such as face glass surfaces of CRT or flat displays, but also to smaller-size surfaces that may be held to the substrate carrier 10 or cover 9 not comprising openings and facing inward the vacuum chamber 1.

In this case, the process of coating on the surface of said substrates remains unchanged.

Besides, the substrate carrier 10 may be disposed outside the vacuum module serving as a fixing member of a substrate and creating favorable conditions for the

preliminary placement, transfer and positioning of the substrates on the module to perform the process of coating on the surface thereof.

The claimed system of modules for applying coatings to kinescope surfaces (Fig-5) comprises at least two vacuum modules 30,31 constructed by any of three variants and having a common vacuum pumping system 32 and process sensors 33.

These modules 30,31 are provided with a common vacuum pumping control system 34, a common handling-device control system 35 comprising a transporter 36 and a manipulator-loader 37 allowing for simultaneously servicing an unlimited number of modules disposed within the operating zone of the common manipulator-loader 37.

The common vacuum pumping system 32 consists of two forevacuum evacuation stations 38 and 39, and the common manipulator-loader 37 positions and removes CRTs from the modules of different modifications.

The CRTs may be preliminary placed and fixed in the openings of the substrate carrier 10, and the manipulator-loader 37 may jointly with the substrate carrier 10 place the CRT on the module for coating thin films on the surface thereof.

The clamed system of modules for coating on a substrate operates in the following manner.

To service the groups of modules (two or more) to simultaneously coating on the CRT of different modifications, for example, 19"and 21", the CRT of standard sizes are placed on the openings in vacuum chambers of the modules 30,31 matching the parameters of said openings.

The vacuum pumping control system 34 comprises vacuum pumping stations 38, 39. The station 39 evacuates all diffusion pumps integrated into a common evacuation system 32 of the modules 30 and 31, while the station 38 alternately evacuates the vacuum chambers 1 of said modules.

Simultaneously, the handling-device control system 35 supplies a signal to the transporter 36 and the common manipulator-loader 37 via sensors 33, of them the former supplies and the latter places the CRT on the openings of the modules 30,31 for coating on their front surfaces.

In this case, the sensor 33 provides information about the CRT size and type. This information is used to start a specific process variant at a specific module, i. e. the processing components that will ensure coating of the necessary materials will be mounted, and while the coating process proper and modes thereof remain unchanged.

A common computer running a specially developed software program controls the coating process. To perform said process, the needed processing components, for example,

the ionic cleaning source and the ionic-sputtering source 21 with the rotary prism 22, the faces of which contain various materials to be sputtered, are mounted on the carriage 16.

In other cases, when other materials need to be sputtered, a magnetron cathode 18 or cathode-deposition targets 19 are mounted on the carriage 16. In some cases any other processing components, for example, evaporators 17 may be mounted on the carriage 16 as a source of the material to be coated.

Working gases are fed into the gasmain of sources 20,21 mounted on the movable carriage 16 via a cable laying machine Cl, in which a set of flexible tubes and cables is disposed, and a gas/water/power supply system 24, thereby simultaneously cooling and powering the vacuum chamber 1 and processing components 17,18,19,20,21,22 and 23.

When signals arrive from the sensors 33 to the common manipulator-loader 37, the latter places CRTs of specific standard sizes on the respective openings in the vacuum chamber 1 or in the substrate carrier 10 or in the cover 9 (depending on the module embodiment) of different modules and, once the required pressure in vacuum chambers 1 of said modules is reached using a pre-evacuation pump (forepump) 27 and a high-vacuum evacuation pump (diffusion pump) 28, the process of coating on CRT glass by the above disclosed process occurs, with all devices and components the module comprises being engaged.

The proposed system for coating on a substrate has a higher reliability compared to that of conventional vacuum in-line systems of a similar application, since a failure of one or several modules does not entail a complete system shutdown.

Besides, the system may be expanded, if required, by integrating additional modules or reduced by withdrawing some modules therefrom.

The multifunctionality of the vacuum module and variants thereof ensures applying high-quality coatings not only to small-size, but also to large-size surfaces.

The optical and quartz control of the coating thickness allows the process of coating multi-layer film structures not only on the surface of CRT glass, but also to other substrates to be reproduced.

The vacuum module and variants thereof being claimed are multifunctional and feature high performance.

Besides, due to versatility thereof, the vacuum module and variants thereof being claimed may be used for coating on the substrates in any combinations and modifications in flexible manipulation vacuum systems.

The modules being claimed are interchangeable without hindering continuity of the vacuum system operation as a whole.

Besides, any failure of individual system units does not affect the operation of the whole system, i. e. the failure of at least one module does not lead to the shutdown of the whole system and thus, the reliability and further operation thereof is maintained.

The module (variants thereof) and system of modules designed for coating on the substrates being provided as the invention are versatile and commercially applicable.

References Cited: 1. US Patent No. 5489369, IPC C23C 14/56, publ. 06.02.1996.

2. DE Patent No. P4313353.3, IPC. C23C 14/22, publ. 27.10.1994.

3. US Patent No. 5372693, IPC C23C 14/34, publ. 13.12.1994.