Title:
COPPER-CLAD LAMINATE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/030645
Kind Code:
A1
Abstract:
[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible circuit board, and a manufacturing method thereof. [Solution] This copper-clad laminate is characterized by including a low dielectric resin film which has a relative dielectric constant of 3.5 or lower and a dielectric loss tangent of 0.008 or lower at a frequency of 10 GHz and an electroless copper plating layer which is laminated on at least one surface of the low dielectric resin film, wherein the electroless copper plating layer has a Ni-content of 0.01 to 1.2 wt%, and the electroless copper plating layer has a volume resistivity of 6.0 µΩ·cm or lower.
Inventors:
YOSHIMATSU YOUHEI (JP)
MUKAI NOBUAKI (JP)
YOSHIDA TAKAHIRO (JP)
MUKAI NOBUAKI (JP)
YOSHIDA TAKAHIRO (JP)
Application Number:
PCT/JP2021/029462
Publication Date:
February 10, 2022
Filing Date:
August 07, 2021
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
C23C28/02; B32B15/08; C23C18/16; C23C18/20; C23C18/30; C23C18/40; C23C18/48; C25D5/34; C25D5/56; C25D7/00; H05K1/03; H05K3/18; H05K3/38
Foreign References:
| JP2007305660A | 2007-11-22 | |||
| JP2007154306A | 2007-06-21 | |||
| JP2005171287A | 2005-06-30 | |||
| JP2002256443A | 2002-09-11 | |||
| JP2001020077A | 2001-01-23 | |||
| JP2002093747A | 2002-03-29 | |||
| JP2003013247A | 2003-01-15 | |||
| JPS5229970B2 | 1977-08-05 |
Attorney, Agent or Firm:
OHTA PATENT AND TRADEMARK ATTORNEYS (JP)
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