COPPER-CLAD LAYERED BODY AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2022/030644

A1

[Problem] To provide: a copper-clad layered body which, when applied to a flexible circuit board, is capable of suppressing transmission loss and achieving good volume resistivity and high adhesion between a low-dielectric resin film and a copper plate layer; and a method for producing the same. [Solution] This copper-clad layered body is characterized by: comprising a low-dielectric resin film having a relative permittivity of 3.5 or less and a dielectric loss tangent of 0.008 or less at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low-dielectric resin film; the weighted average size of crystallites in the electroless copper plating layer being 25 to 300 nm; and the adhesion strength between the resin film and the electroless copper plating layer being 4.2 N/cm or more.

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MUKAI NOBUAKI (JP)
YOSHIDA TAKAHIRO (JP)
YOSHIMATSU YOUHEI (JP)

PCT/JP2021/029461

February 10, 2022

August 07, 2021

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TOYO KOHAN CO LTD (JP)

C23C28/02; B32B15/08; C23C18/16; C23C18/20; C23C18/30; C23C18/40; C25D5/34; C25D5/56; C25D7/00; H05K1/03; H05K3/18; H05K3/38

WO2007039992A1

2007-04-12

JP2012112028A	2012-06-14
JP2007262493A	2007-10-11
JP2009274250A	2009-11-26
JP2003001756A	2003-01-08
JP2002256443A	2002-09-11
JP2012023296A	2012-02-02
JP2015084301A	2015-04-30
JP2012038823A	2012-02-23

OHTA PATENT AND TRADEMARK ATTORNEYS (JP)

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